tag: TSMC

Americas Chip Funding Energizes Industry
By Liz Allan - 23 Oct, 2024 - Comments: 0

This is the second in a series of articles tracking government chip investments. See part one here (global),  part 3 covering EMEA is here and Asia here. Since the first announcement of a non-binding preliminary memorandum of terms with BAE Systems in December 2023, the U.S. Department of Commerce has rolled out comprehensive plans to support more than a dozen companies in order to shore up... » read more

Chip Industry Week In Review
By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Chip Industry Technical Paper Roundup: Oct. 8
By Linda Christensen - 08 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=365 /] More ReadingTechnical Paper Library home » read more

Government Chip Funding Spreads Globally
By Liz Allan - 07 Oct, 2024 - Comments: 0

This is the first in a series of articles tracking government chip investments. See part two for Americas-focused funding and part three for the UK and EMEA, and part four for Asia. Countries around the world are ramping up investments into their semiconductor industries as part of new or existing approaches. The increased government activity stems from growing awareness of the strategic imp... » read more

Review Paper: Challenges Required To Bring the Energy Consumption Down in Microelectronics (Rice, UC Berkeley, Georgia Tech, Et al.)
By Technical Paper Link - 06 Oct, 2024 - Comments: 0

A new review article titled "Roadmap on low-power electronics" by researchers at Rice University, UC Berkeley, Georgia Tech, TSMC, Intel, Harvard, et al. This roadmap to energy efficient electronics written by numerous collaborators covers materials, modeling, architectures, manufacturing, metrology and more. Find the technical paper here. September 2024. Ramamoorthy Ramesh, Sayeef Sal... » read more

Chip Industry Week In Review
By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

TSMC’s Plan For Closing The Communication Gap
By Barry Pangrle - 03 Oct, 2024 - Comments: 0

TSMC held its North American Open Innovation Platform (OIP) Ecosystem Forum at the Santa Clara County Convention Center on Sept. 25, providing a quick roadmap update and to recognize its partners for all the collaborative work needed to keep the TSMC innovation train rolling and enabling its customers to utilize the latest technologies. L.C. Lu, TSMC fellow and vice president of R&D, sai... » read more

Chip Industry Technical Paper Roundup: Oct. 1
By Linda Christensen - 01 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=360 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 27 Sep, 2024 - Comments: 0

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
By Technical Paper Link - 26 Sep, 2024 - Comments: 2

A new technical paper titled "Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference" was published by researchers at Georgia Tech, TSMC and National Tsing Hua University. Abstract "Recently, a novel model named Kolmogorov-Arnold Networks (KAN) has been proposed with the potential to achieve the functionality of traditional deep neural networks (DNNs) using ... » read more

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