tag: TSMC

Fan-Out Wars Begin
By Mark LaPedus - 05 Feb, 2018 - Comments: 3

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Cheaper Packaging Options Ahead
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

Dawn Of The Data-Centric Era
By Lara Chamness - 31 Jan, 2018 - Comments: 0

A recurring theme of the recent Industry Strategy Symposium (ISS) in Half Moon Bay, California, was how the explosion of new applications such as autonomous vehicles, digital healthcare, quantum computing, and crytocurrency mining are driving the need for more industry-wide collaboration to enable companies to compete in the “Data Centric” era. The resulting digital economy is creating unpr... » read more

Blog Review: Jan. 31
By Jesse Allen - 31 Jan, 2018 - Comments: 0

Cadence's Paul McLellan looks back at where TSMC was 30 years ago and the founding philosophy that made the foundry and fabless model work. In a video, Mentor's Colin Walls considers how to make the simplest possible multitasking scheduler with a one line RTOS. Synopsys' Sandeep Taneja checks out the technology behind airbags in cars and the role of the Motorola Serial Peripheral Interfac... » read more

Manufacturing Bits: Jan. 30
By Mark LaPedus - 30 Jan, 2018 - Comments: 0

SRC’s new R&D centers The Semiconductor Research Corp. has launched a network of research centers within its recently-announced Joint University Microelectronics Program (JUMP). SRC officially launched the 5-year, $200 million program on Jan. 1. With various research centers, the mission of JUMP is to lay the groundwork that extends the viability of Moore’s Law through 2040. The idea is... » read more

Nodes Vs. Nodelets
By Mark LaPedus - 22 Jan, 2018 - Comments: 0

Foundries are flooding the market with new nodes and different process options at existing nodes, spreading confusion and creating a variety of challenges for chipmakers. There are full-node processes, such as 10nm and 7nm, with 5nm and 3nm in R&D. But there also is an increasing number of half-nodes or "node-lets" being introduced, including 12nm, 11nm, 8nm, 6nm and 4nm. Node-lets ar... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Jan, 2018 - Comments: 0

Market research The SEMI Industry Strategy Symposium (ISS) opened with the theme “Smart, Intuitive & Connected: Semiconductor Devices Transforming the World.” Click here for some of the highlights at ISS. Here are more highlights from ISS. Korea is on a spending spree for fab tools. In total, Samsung and SK Hynix are forecast to invest over $20 billion in fab tools worldwide in 2018... » read more

The Week in Review: IoT
By Jeff Dorsch - 19 Jan, 2018 - Comments: 0

Finance VDOO Connected Trust received $13 million in seed funding led by 83North, with participation by Dell Technology Capital and individual investors David Strohm, Joe Tucci, and Victor Tsao. The startup offers Internet of Things device developers the capability to add cybersecurity features to those devices after they’re deployed. VDOO was founded last year in Israel by Netanel Davidi, U... » read more

The Week In Review: Design
By Jesse Allen - 19 Jan, 2018 - Comments: 0

M&A Barco Silex, now named Silex Inside, split from parent company Barco in a management buyout in partnership with a group of private investors lead by Dutch investment company Vehold BV. The company will continue its focus on security, video compression, and interface IP, along with design services. Tools & IP Mentor is making a version of its HyperLynx design rule checking tool ... » read more

The Future Of FinFETs
By Ed Sperling - 18 Jan, 2018 - Comments: 0

The number of questions about finFETs is increasing—particularly, how long can they continue to be used before some version of gate-all-around FET is required to replace them. This discussion is confusing in many respects. For one thing, a 7nm finFET for TSMC or Samsung is not the same as a 7nm finFET for Intel or GlobalFoundries. There are a bunch of other nodes being proposed, as well, i... » read more

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