Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Aug, 2021 - Comments: 0

Automotive The New York Auto Show has been canceled due to concerns over the COVID-19 Delta variant. The show, which usually occurs in April, was scheduled for August 20 through 29th. Semiconductor company Qualcomm has offered to acquire Veoneer, an ADAS company, for $37 per share in cash. Automotive Tier 1 Magna International already has a definitive merger agreement to acquire Veoneer, wh... » read more

Power/Performance Bits: Nov. 17

By Jesse Allen - 17 Nov, 2020 - Comments: 0

NVMe controller for research Researchers at the Korea Advanced Institute of Science and Technology (KAIST) developed a non-volatile memory express (NVMe) controller for storage devices and made it freely available to universities and research institutions in a bid to reduce research costs. Poor accessibility of NVMe controller IP is hampering academic and industrial research, the team argue... » read more

Manufacturing Bits: March 11

By Mark LaPedus - 11 Mar, 2019 - Comments: 0

Measuring molecules The Technical University of Munich (TUM) has developed a new metrology technique that determines the properties of individual molecules. The technique, called single-molecule excitation–emission spectroscopy, improves upon the traditional methods to explore molecules. The traditional method, dubbed single-molecule spectroscopy (SMS), is not new and is used to analyze f... » read more

System Bits: Feb. 19

By Jeff Dorsch - 19 Feb, 2019 - Comments: 0

Eco-friendly material for wireless IoT sensors Researchers at Canada’s Simon Fraser University and in Switzerland collaborated on developing a wood-derived cellulose material that could be used in a 3D printer, instead of the customary plastic and polymeric materials for electronics. With 3D printing, the material can offer flexibility to add or embed functions onto 3D shapes or fabrics, the... » read more

Manufacturing Bits: Oct. 9

By Mark LaPedus - 09 Oct, 2018 - Comments: 0

Super atoms The Technical University of Munich (TUM) has devised what it calls a super atom, a technology that could one day enable a new class of catalysts. TUM developed a cluster made up of 55 copper and aluminum atoms. The cluster looks like a crystal, but it actually has the properties of an atom or a heterometallic super atom. The super atom could one day be used to develop more cost-... » read more

System Bits: Dec. 10

By Brian Bailey - 10 Dec, 2013 - Comments: 0

Lasers From Nano Wires A few weeks ago, Semiconductor Engineering published a special report about silicon photonics and concentrated on the integration of the laser onto the silicon surface. Growing III-V materials on silicon is problematic because of the lattice mismatch, but researchers at the Technische Universität München (TUM) may have found a way around that problem. Thread-like semic... » read more

Manufacturing Bits: Nov. 26

By Mark LaPedus - 26 Nov, 2013 - Comments: 0

Arctic Neutrinos From Space Technische Universitaet Muenchen (TUM) has observed high-energy neutrinos stemming from outside the solar system, an event that could provide some clues about the universe. Researchers observed the sub-atomic particles at IceCube, a huge neutrino detector in Antarctica. TUM has observed 28 neutrinos that most likely came from cosmic objects. The IceCube observato... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer