Manufacturing Bits: July 16

By Mark LaPedus - 16 Jul, 2018 - Comments: 0

Levitating metrology The Instituto de Ciencias Físicas UNAM has developed a new contaminant detection technique. It uses sound waves to levitate droplets of water for sampling purposes. Researchers use a technique called laser induced breakdown spectroscopy (LIBS). The technique analyzes heavy metals in levitating drops of water, according to The Optical Society (OSA) journal Optics Letter... » read more

Blazing-Fast Performance

By Ed Sperling - 14 Jun, 2018 - Comments: 0

When it comes to raw performance, there's nothing like a supercomputer. Until recently, though, most of this was simply bragging rights about whose supercomputer was faster. A trillion calculations (petaflop), more or less, doesn't mean that much outside of scientific circles. What's changing is that companies and governments now can utilize these blazing fast machines across a wider swath o... » read more

Manufacturing Bits: April 3

By Mark LaPedus - 03 Apr, 2018 - Comments: 0

World's brightest accelerator Japan’s High Energy Accelerator Research Organization (KEK) is readying what is considered the world’s most luminous or brightest particle accelerator. The system, dubbed the SuperKEKB, combines an electron-positron collider with a new and advanced detector. The storage ring system is designed to explore and measure rare decays of elementary particles, such... » read more

Manufacturing Bits: Jan. 2

By Mark LaPedus - 02 Jan, 2018 - Comments: 0

World’s coldest chip Using a network of nuclear refrigerators, the University of Basel and others claim to have set the record for the world’s coldest chip. Researchers have cooled a chip to a temperature lower than 3 millikelvin. A millikelvin is one thousandth of a kelvin. Absolute zero is 0 kelvin or minus 273.15 °C. In the experiment, researchers used a chip that includes a Coulomb... » read more

The Week In Review: IoT

By Jeff Dorsch - 23 Dec, 2016 - Comments: 0

M&A TDK has agreed to acquire InvenSense for $13 a share, representing a total of $1.3 billion in cash. The transaction must be approved by InvenSense shareholders and regulatory agencies; TDK expects to wrap up the deal in the second quarter of its fiscal year ending in March of 2018 (the third quarter of the calendar year). Apple accounted for 40% of InvenSense’s revenue for the fiscal... » read more

Manufacturing Bits: June 21

By Mark LaPedus - 21 Jun, 2016 - Comments: 0

Atomic sculpting Oak Ridge National Laboratory has combined a scanning transmission electron microscope (STEM) with new electronic controls. This tool enables the construction, or the atomic sculpting, of 3D-like feature sizes down to 1nm and 2nm. To achieve these dimensions, the STEM is controlled with a special set of programmable electronics. This, in turn, enables the STEM to tunnel in... » read more

Manufacturing Bits: May 10

By Mark LaPedus - 10 May, 2016 - Comments: 0

Diamond polarimeters The Thomas Jefferson National Accelerator Facility (Jefferson Lab) has achieved what it says are the highest precision measurements of polarization in an atom smasher. The measurements were conducted with an instrument called a Hall C Compton Polarimeter. The polarimeter makes use of electron-photon scattering techniques and diamond-based microstrip detectors. The g... » read more

Searching For The Next Power Transistor

By Mark LaPedus - 22 Jan, 2015 - Comments: 0

For decades, the industry has relied on various power semiconductors to control and convert electrical power in an efficient manner. Power semis are ubiquitous, as they are found in adapters, appliances, cars, elevators, switching power supplies, power grids and other systems. But today’s silicon-based power semiconductor transistor technologies, such as IGBTs, MOSFETs and thyristors, are ... » read more

Power/Performance Bits: July 29

By Ed Sperling - 29 Jul, 2014 - Comments: 0

Cool Magnets MIT researchers believe that magnets on the outside of the refrigerator may someday be used for cooling. Magnons, which are essentially a collective spin wave or quasi-particle, are also conductors of heat. MIT researchers found that when exposed to a magnetic field gradient, magnons can be driven from one end of a magnet to another, carrying heat with them. “You can p... » read more

What Comes Next?

By SEMI - 27 Jun, 2014 - Comments: 0

The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 (www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between sem... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: U.S. Department of Energy