tag: UC Berkeley

Chip Industry Technical Paper Roundup: Apr. 29
By Linda Christensen - 29 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=424 /] Find more semiconductor research papers here. » read more

Impact Of Cryogenic Temps On The Minimum-Operating Voltage Of 5nm FinFETs-Based SRAM (IIT, UC Berkeley et al)
By Technical Paper Link - 25 Apr, 2025 - Comments: 0

A new technical paper titled "An Investigation of Minimum Supply Voltage of 5nm SRAM from 300K down to 10K" was published by researchers at Indian Institute of Technology, UC Berkeley and Munich Institute of Robotics and Machine Intelligence. Abstract "In this article, we present a comprehensive study of the impact of cryogenic temperatures on the minimum-operating voltage (Vmin) of 5 nm ... » read more

Chip Industry Week in Review
By The SE Staff - 25 Apr, 2025 - Comments: 0

To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Chip Industry Technical Paper Roundup: Apr. 22
By Linda Christensen - 22 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=421 /] Find more semiconductor research papers here. » read more

Board-Level Packaging Method For Device Encapsulation To Enable Water Immersion Cooling
By Technical Paper Link - 14 Apr, 2025 - Comments: 0

A new technical paper titled "Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling" was published by researchers at University of Illinois, Urbana, University of Arkansas and UC Berkeley. Abstract "Power densification is making thermal design a key step in the development of future electrical devices. Systems such as data centers and electric vehicl... » read more

Chip Industry Week In Review
By The SE Staff - 04 Apr, 2025 - Comments: 0

Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

Chip Industry Week In Review
By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Chip Industry Week In Review
By The SE Staff - 14 Feb, 2025 - Comments: 0

Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group. CSIS released a new report, “Critical Minerals and the Future of the U.S. Economy,” with detailed analysis and policy recommendations for building a secure mineral supply chain for semicond... » read more

Chip Industry Technical Paper Roundup: Dec. 3
By Linda Christensen - 03 Dec, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=391 /] » read more

Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)
By Technical Paper Link - 26 Nov, 2024 - Comments: 0

A new technical paper titled "Pie: Pooling CPU Memory for LLM Inference" was published by researchers at UC Berkeley. Abstract "The rapid growth of LLMs has revolutionized natural language processing and AI analysis, but their increasing size and memory demands present significant challenges. A common solution is to spill over to CPU memory; however, traditional GPU-CPU memory swapping ofte... » read more

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