tag: UCIe

From Known Good Die To Known Good System With UCIe IP
By Manuel Mota - 11 May, 2023 - Comments: 0

Multi-die systems are made up of several specialized functional dies (or chiplets) that are assembled in the same package to create the complete system. Multi-die systems have recently emerged as a solution to overcome the slowing down of Moore’s law by providing a path to scaling functionality in the packaged chip in a way that is manufacturable with good yield. Additionally, multi-die sy... » read more

How The Doubling Of Interconnect Bandwidth With PCI Express 6.0 Impacts IP Electrical Validation
By Synopsys - 09 May, 2023 - Comments: 0

As a result of the innovations taking place in CPUs, GPUs, accelerators, and switches, the interface in hyperscale datacenters now requires faster data transfers both between compute and memory and onto the network. PCI Express (PCIe) provides the backbone for these interconnects and is used to build protocols such as Computer Express Link (CXL) and Universal Chiplet Interconnect Express (UCIe... » read more

Chiplets: More Standards Needed
By Andy Heinig - 13 Apr, 2023 - Comments: 1

Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

The Race Toward Mixed-Foundry Chiplets
By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Mini-Consortia Forming Around Chiplets
By Ed Sperling - 20 Mar, 2023 - Comments: 0

Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. These loosely aligned partnerships are working to develop LEGO-like integration models for highly specific applications and end markets. But they all are starting small, because it'... » read more

How The Doubling Of Interconnect Bandwidth With PCI Express 6.0 Impacts IP Electrical Validation
By Synopsys - 07 Mar, 2023 - Comments: 0

As a result of the innovations taking place in CPUs, GPUs, accelerators, and switches, the interface in hyperscale datacenters now requires faster data transfers both between compute and memory and onto the network. PCI Express (PCIe®) provides the backbone for these interconnects and is used to build protocols such as Computer Express Link (CXL™) and Universal Chiplet Interconnec... » read more

Will AI Take My Job?
By Brian Bailey - 23 Feb, 2023 - Comments: 0

Everyone is talking about ChatGPT these days, and I am sure we will be comparing it with Google's new offering before long. I thought it was time that I gave it a quick spin, and since I am preparing to moderate a webinar about chiplets as I write this, I decided it was a good example of a fairly new field and would be a good test. I started by asking, "What are semiconductor chiplets, what ... » read more

Chiplets Taking Root As Silicon-Proven Hard IP
By Ann Mutschler - 09 Feb, 2023 - Comments: 0

Chiplets are all the rage today, and for good reason. With the various ways to design a semiconductor-based system today, IP reuse via chiplets appears to be an effective and feasible solution, and a potentially low-cost alternative to shrinking everything to the latest process node. To enable faster time to market, common IP or technology that already has been silicon-proven can be utilized... » read more

What Does 2023 Have In Store For Chip Design?
By Brian Bailey - 26 Jan, 2023 - Comments: 0

Predictions seem to be easier to make during times of stability, but they are no more correct than at any other period. During more turbulent times, fewer people are courageous enough to allow their opinions to be heard. And yet it is often those views that are more well thought through, and even if they turn out not to be true, they often contain some very enlightening ideas. 2022 saw some ... » read more

The Path To Known Good Interconnects
By Laura Peters - 19 Jan, 2023 - Comments: 1

Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and predictable ways is becoming a challenge as the number of options continues to grow. More possibilities also bring more potential interac... » read more

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