Manufacturing Bits: Oct. 27


CD-SAXS makes progress For years, chipmakers have used metrology tools based on various optical techniques, such as scatterometry. But optical-based scatterometry may one day run out of steam, prompting the need for a possible replacement. One long-awaited candidate is called X-ray scattering. There are various flavors of X-ray scattering, including CD small-angle X-ray scattering (CD-SAXS)... » read more

Manufacturing Bits: Oct. 6


Magnetic mass spectrometers The National High Magnetic Field Laboratory (National MagLab) has developed a mass spectrometer, based on what the organization claims is the world’s highest field superconducting magnet. The instrument from National MagLab is called a Fourier transform ion cyclotron resonance (FT-ICR) mass spectrometer. The mass spectrometer boasts a 21 tesla magnet, which is ... » read more

Power/Performance Bits: Oct. 6


Portabella batteries Researchers at the University of California, Riverside created a new type of lithium-ion battery anode using portabella mushrooms, which are inexpensive, environmentally friendly and easy to produce. The current industry standard for rechargeable lithium-ion battery anodes is synthetic graphite, which comes with a high cost of manufacturing because it requires tedious pu... » read more

Manufacturing Bits: Sept. 1


Free-electron laser EUV consortium Extreme ultraviolet (EUV) lithography is delayed. Chipmakers hope to insert EUV at the 7nm node, but that’s not a given. As before, the big problem is the EUV light source. So far, the source can’t generate enough power to enable the required throughput for EUV in high-volume production. ASML’s current EUV source is operating at 80 Watts, up from 10 ... » read more

System Bits: July 28


Massless particles for faster electronics Princeton University researchers along with an international team have finally proved a massless particle that had been theorized for 85 years. They say this particle could give rise to faster and more efficient electronics because of its unusual ability to behave as matter and antimatter inside a crystal. [caption id="attachment_21431" align="align... » read more

System Bits: July 21


White graphene can take the heat According to researchers at Rice University, 3D boron nitride structures excel at thermal management for electronics. Rice researchers Rouzbeh Shahsavari and Navid Sakhavand have completed the first theoretical analysis of how 3D boron nitride might be used as a tunable material to control heat flow in such devices. In its 2D form, hexagonal boron nitride... » read more

DAC 2015 Day 2: Keynotes, Tutorials and More


Walking to DAC, you had to pass the Apple Developers Conference. The line to get in wrapped all the way around the block and there were many peaceful protests directed towards them. Large TV trucks, trucks from CNN, MSNBC and many others lined the streets to hear about new capabilities coming to the group of people who create the Apps for Apple devices. None of them were probably even aware tha... » read more

Power/Performance Bits: April 7


Hybrid supercapacitors Researchers at UCLA combined the best qualities of batteries and supercapacitors in a new 3-D hybrid supercapacitor. Based on laser-scribed graphene and manganese dioxide, the new component stores large amounts of energy, recharges quickly and can last for more than 10,000 recharge cycles. The team also created a microsupercapacitor small enough to fit in wearable o... » read more

Power/Performance Bits: Feb. 24


Simulating ultrafast phenomena Interesting phenomena can happen when electronic states in materials are excited during dynamic processes. As an example, electrical charge transfer can take place on quadrillionth-of-a-second, or femtosecond, timescales. Numerical simulations in real-time provide the best way to study these processes. Such simulations, however, can be extremely expensive. R... » read more

System Bits: Feb. 10


Mapping temperature Given that overheating is a major problem for chips today a team of UCLA and USC scientists have made a breakthrough that they believe should enable engineers to design microprocessors that minimize that problem with a thermal imaging technique that can see how the temperature changes from point to point inside the smallest electronic circuits. The technique is called pl... » read more

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