Mechanical Characterization Of Ultra Low-k Dielectric Films

Dielectric materials are of critical importance in the function of microelectronic devices because they electrically isolate conductive components from one another in microcircuits. Capacitance between conductors can limit a circuit’s maximum operating frequency, and the capacitance increases in inverse proportion to the separation distance between the conductors. Therefore, to minimize the s... » read more

Chip Board Interaction Analysis Of 22nm FD-SOI Technology In WLP

Recently, Wafer Level Packaging (WLP) has been in high demand, especially in mobile device applications as a path to enable miniaturization while maintaining good electrical performance. The relatively inexpensive package cost and simplified supply chain are encouraging other industries to adapt WLP capabilities for radio frequency (RF), communications/sensing (mmWave) and automotive applicatio... » read more