tag: UMC

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Nov, 2021 - Comments: 0

Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Oct, 2021 - Comments: 0

Chipmakers After years in the works, GlobalFoundries is finally a public company. But on its first day of trading on Thursday (Oct. 28), shares of the foundry vendor slipped a bit. GF finished its first day of trading at $46.40. This compares to the $47 per share it priced in the initial public offering (IPO), according a report to Reuters. The chipmaker has a market capitalization of about $2... » read more

Scaling Bump Pitches In Advanced Packaging
By Mark LaPedus - 25 Oct, 2021 - Comments: 0

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump approaches while others roll out new ones to replace them. The goal in all cases is to ensure signal integrity between components in IC packages as the volume of data being processed increases. But as d... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Oct, 2021 - Comments: 0

Chipmakers Apple has introduced its latest MacBook Pro notebooks built around the company’s new, in-house designed processors, dubbed the M1 Pro and M1 Max. The chips, to be incorporated in its 14- and 16-inch MacBook Pro systems, are the most powerful devices developed by Apple. The CPUs in the M1 Pro and M1 Max chips deliver up to 70% faster performance than the first M1 device. Based ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Oct, 2021 - Comments: 0

Government policy Hoping to resolve the ongoing worldwide chip shortage situation, the U.S. Department of Commerce late last month launched a “request for information (RFI)” initiative, which involved sending questionnaires to various semiconductor companies. The U.S. government is asking all parts of the supply chain – producers, consumers, and intermediaries – to voluntarily share in... » read more

Gearing Up For Next-Gen Power Semis
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

After years in R&D, several vendors are moving closer to shipping power semiconductors and other products based on next-generation wide-bandgap technologies. These devices leverage the properties of new materials, such as aluminum nitride, diamond, and gallium oxide, and they are also utilized in different structures, such as vertical gallium-nitride power devices. But while many of thes... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Sep, 2021 - Comments: 0

Chipmakers, OEMs Intel plans to establish foundry capacity at its fab in Ireland. The company has also launched the so-called Intel Foundry Services Accelerator to help automotive chip designers transition from mature to advanced nodes. The company is setting up a new design team and offering both custom and industry-standard intellectual property (IP) to support the needs of automotive custom... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Sep, 2021 - Comments: 1

OEMs For some time, the automotive industry has suffered due to chip shortages in the market. And the chip shortages are spreading into other markets. In the latest news, GM plans to idle key truck plants amid chip shortages, according to a report from Bloomberg. “GM said eight of its 14 North American assembly plants will experience shutdowns this month because of chip shortages, includi... » read more

Angstrom-Level Measurements With AFMs
By Mark LaPedus - 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

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