tag: UMC

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Oct, 2021 - Comments: 0

Chipmakers Apple has introduced its latest MacBook Pro notebooks built around the company’s new, in-house designed processors, dubbed the M1 Pro and M1 Max. The chips, to be incorporated in its 14- and 16-inch MacBook Pro systems, are the most powerful devices developed by Apple. The CPUs in the M1 Pro and M1 Max chips deliver up to 70% faster performance than the first M1 device. Based ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Oct, 2021 - Comments: 0

Government policy Hoping to resolve the ongoing worldwide chip shortage situation, the U.S. Department of Commerce late last month launched a “request for information (RFI)” initiative, which involved sending questionnaires to various semiconductor companies. The U.S. government is asking all parts of the supply chain – producers, consumers, and intermediaries – to voluntarily share in... » read more

Gearing Up For Next-Gen Power Semis
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

After years in R&D, several vendors are moving closer to shipping power semiconductors and other products based on next-generation wide-bandgap technologies. These devices leverage the properties of new materials, such as aluminum nitride, diamond, and gallium oxide, and they are also utilized in different structures, such as vertical gallium-nitride power devices. But while many of thes... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Sep, 2021 - Comments: 0

Chipmakers, OEMs Intel plans to establish foundry capacity at its fab in Ireland. The company has also launched the so-called Intel Foundry Services Accelerator to help automotive chip designers transition from mature to advanced nodes. The company is setting up a new design team and offering both custom and industry-standard intellectual property (IP) to support the needs of automotive custom... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Sep, 2021 - Comments: 1

OEMs For some time, the automotive industry has suffered due to chip shortages in the market. And the chip shortages are spreading into other markets. In the latest news, GM plans to idle key truck plants amid chip shortages, according to a report from Bloomberg. “GM said eight of its 14 North American assembly plants will experience shutdowns this month because of chip shortages, includi... » read more

Angstrom-Level Measurements With AFMs
By Mark LaPedus - 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Aug, 2021 - Comments: 0

Chipmakers and OEMs Samsung has announced its latest foldable smartphones--the Galaxy Z Fold3 5G and Galaxy Z Flip3 5G. The systems are based on Samsung’s 5nm application processor. One system is the company’s most affordable foldable phone. The Galaxy Z Fold3 is $1,799.99, while the Galaxy Z Flip3 is $999.99. Samsung also announced two smartwatches—the Galaxy Watch4 and Galaxy Watch4... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Jul, 2021 - Comments: 0

Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes, revealed its new gate-all-around (GAA) transistor, and disclosed a customer for the GAA technology--Qualcomm. And not to be outdone, Intel has broadened its packaging portfolio. Intel is changing ... » read more

Intel/GF deal: Pros, Cons, Unknowns
By Mark LaPedus - 22 Jul, 2021 - Comments: 1

The industry is still buzzing over a Wall Street Journal report that Intel is in talks to acquire GlobalFoundries (GF) for $30 billion. It’s been a week since the report appeared. Intel is still mum. GF says there are no talks taking place. Regardless, it’s worth looking at all of the possible scenarios just in case, and the pros and cons involved. There are layers upon layers of iron... » read more

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