tag: UMC

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Oct, 2020 - Comments: 1

Chipmakers and OEMs AMD is in talks to acquire Xilinx in a deal that could be worth more than $30 billion, according to a report from The Wall Street Journal. If the deal transpires, AMD will enter the FPGA business, putting it further in competition with Intel. No deal has been struck, though. --------------------------------------------- Multiple sources believe that China’s Huawei i... » read more

DRAM, 3D NAND Face New Challenges
By Mark LaPedus - 21 Sep, 2020 - Comments: 1

It’s been a topsy-turvy period for the memory market, and it's not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In addition, the 3D NAND market is moving toward a new technology generation, but some are enc... » read more

Momentum Builds For Advanced Packaging
By Mark LaPedus - 17 Sep, 2020 - Comments: 0

The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce p... » read more

Interconnects Emerge As Key Concern For Performance
By Ed Sperling - 03 Sep, 2020 - Comments: 0

Interconnects are becoming increasingly challenging to design, implement and test as the amount of data skyrockets and the ability to move that data through denser arrays of compute elements and memories becomes more difficult. The idea of an interconnect is rather simple, but ask two people what constitutes an interconnect and you're likely to get very different answers. Interconnects are e... » read more

New Architectures, Much Faster Chips
By Ed Sperling and Ann Mutschler - 31 Aug, 2020 - Comments: 0

The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Aug, 2020 - Comments: 0

Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Marvell is working on silicon for the data infrastructure market using TSMC’s 5nm process node. Marvell says it has multiple designs already under contract for its 5nm portfolio across the carrier, enterprise, automotive, and data center markets. The first products are sampling by the end of next year.  Ansys’ multiphysics signoff tools, R... » read more

Power Amp Wars Begin For 5G
By Mark LaPedus - 24 Aug, 2020 - Comments: 2

Demand is increasing for power amplifier chips and other RF devices for 5G base stations, setting the stage for a showdown among different companies and technologies. The power amplifier device is a key component that boosts the RF power signals in base stations. It's based on two competitive technologies, silicon-based LDMOS or RF gallium nitride (GaN). GaN, a III-V technology, outperforms ... » read more

Moore’s Law Enters The 4th Dimension
By Ed Sperling - 21 Aug, 2020 - Comments: 5

The basic idea that more transistors are better hasn't changed in more than half a century. In fact, the overriding theme of a number of semiconductor conferences this month is that we will never have enough compute capability or storage capacity. In the past, when the number of transistors in a given area actually did double every 18 to 24 months, increasing density per square millimeter fo... » read more

Recovery In Flat-Panel Display Biz
By Mark LaPedus - 20 Aug, 2020 - Comments: 0

The flat-panel display market is starting to recover after a period of oversupply and lackluster growth, fueled by new technologies as well as more people working from home. The flat-panel display market is complex. Several different technologies are at play, such as liquid-crystal displays (LCDs) for TV screens and other products, as well as organic light-emitting diodes (OLEDs) for smartph... » read more

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