tag: UMC

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Jul, 2020 - Comments: 0

Arm's parent company, Japanese tech conglomerate Softbank, reportedly is considering a sale or IPO of its Arm subsidiary, which it purchased in 2016 for $32 billion in cash. Considering that Arm chips are in most smart phones, as well as an increasing number of computers and IoT and edge devices, this development is being closely followed by most of the tech world. Last week, Softbank directed ... » read more

Speeding Up The R&D Metrology Process
By Mark LaPedus - 16 Jul, 2020 - Comments: 0

Several chipmakers are making some major changes in the characterization/metrology lab, adding more fab-like processes in this group to help speed up chip development times. The characterization/metrology lab, which is generally under the radar, is a group that works with the R&D organization and the fab. The characterization lab is involved in the early analytical work for next-generati... » read more

Easier Low Power ICs With Reference Flows
By Terence Chen - 09 Jul, 2020 - Comments: 0

By Terence Chen and Alexander Volkov Power-sensitive ICs for wearables and internet of things (IoT) products are in demand for markets ranging from automotive to military/aerospace to consumer. As with most ICs, cost and time-to-market pressures are important determiners of success. Reducing risk by using a vendor-created reference flow can confer a serious business advantage. Reference f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Jun, 2020 - Comments: 0

Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

China Speeds Up Advanced Chip Development
By Mark LaPedus - 22 Jun, 2020 - Comments: 18

China is accelerating its efforts to advance its domestic semiconductor industry, amid ongoing trade tensions with the West, in hopes of becoming more self-sufficient. The country is still behind in IC technology and is nowhere close to being self-reliant, but it is making noticeable progress. Until recently, China’s domestic chipmakers were stuck with mature foundry processes with no pres... » read more

The Next Advanced Packages
By Mark LaPedus - 18 Jun, 2020 - Comments: 4

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

Pandemics And Panic Chip Buying
By Mark LaPedus - 18 Jun, 2020 - Comments: 0

U.S.-China trade tensions are creating uncertainty in the semiconductor market, but it is also causing another event right now—panic chip buying. At present, some but not all foundry vendors are seeing “rush orders” for select products and are running their fabs at full capacity. It’s not just leading-edge devices, but also mature technologies. A surge of chip orders started in Ma... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jun, 2020 - Comments: 0

Chipmakers Jim Keller, senior vice president in the Technology, Systems Architecture and Client Group (TSCG) and general manager of the Silicon Engineering Group (SEG) at Intel, has resigned amid a major reorganization at the company. Here's one report about the situation. Cree as well as China’s Yutong Group and StarPower are working together to accelerate the commercial adoption of sili... » read more

The Good And Bad Of Chiplets
By Mark LaPedus - 27 May, 2020 - Comments: 1

The chiplet model continues to gain traction in the market, but there are still some challenges to enable broader support for the technology. AMD, Intel, TSMC, Marvell and a few others have developed or demonstrated devices using chiplets, which is an alternative way to develop an advanced design. Beyond that, however, the adoption of chiplets is limited in the industry due to ecosystem issu... » read more

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