tag: UMC

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 May, 2020 - Comments: 0

Fab tools The U.S. Department of Commerce has announced new export control actions to prevent China, Russia, and Venezuela from obtaining U.S. technology for military purposes. This expands the “Military End Use/User Controls (MEU)” license requirement controls on China, Russia, and Venezuela, covering military end-users, as well as semiconductor equipment, sensors and other technologies. ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 01 May, 2020 - Comments: 0

Data center, 5G security Nvidia won approval for its Mellanox Technologies Ltd. deal from China, according to an article on Bloomberg. Mellanox chips split up and manage AI datasets for parallel processing, which can be used in data centers for computing. Rambus has released security for 800 Gigbit Ethernet MAC (media access control) for enhanced data center and 5G infrastructure. It secure... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Apr, 2020 - Comments: 0

Chipmakers Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. There are already signs that the foundries have pushed out their 3nm production schedules. So, expect 7nm and 5nm to become long-running nodes. At 3nm, Samsung and TSMC are going in different directions. Samsung is developing a gate-all-around (GAA) technology called nanosheet FETs. TSMC will e... » read more

Scaling CMOS Image Sensors
By Mark LaPedus - 20 Apr, 2020 - Comments: 5

After a period of record growth, the CMOS image sensor market is beginning to face some new and unforeseen challenges. CMOS image sensors provide the camera functions in smartphones and other products, but now they are facing scaling and related manufacturing issues in the fab. And like all chip products, image sensors are seeing slower growth amid the coronavirus outbreak. Manufactured a... » read more

Making Chips At 3nm And Beyond
By Mark LaPedus and Ed Sperling - 16 Apr, 2020 - Comments: 4

Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Mar, 2020 - Comments: 0

Chipmakers TrendForce has released its projected foundry rankings in terms of sales for the first quarter. TSMC is still in first place, followed by Samsung, GlobalFoundries and UMC. Samsung has been ramping up chips based on its 7nm logic process using extreme ultraviolet (EUV) lithography. Now, Samsung is ramping up its DRAM devices using EUV and plans to expand its capacity in the arena.... » read more

Memory Issues For AI Edge Chips
By Mark LaPedus - 23 Mar, 2020 - Comments: 3

Several companies are developing or ramping up AI chips for systems on the network edge, but vendors face a variety of challenges around process nodes and memory choices that can vary greatly from one application to the next. The network edge involves a class of products ranging from cars and drones to security cameras, smart speakers and even enterprise servers. All of these applications in... » read more

Auto Outlook: Down But Not Out
By Mark LaPedus - 19 Mar, 2020 - Comments: 0

For years, automotive has been an engine of growth in the semiconductor industry, although the market is expected to decline in 2020. Several types of chips are used in automobiles, such as analog, memory, microcontrollers, processors and RF. But the automotive IC business still represents a small percentage of the overall semiconductor market. It pales in comparison to the smartphone chip m... » read more

Week In Review: Design, Low Power
By Jesse Allen - 06 Mar, 2020 - Comments: 0

Ansys will acquire Lumerical, a developer of photonic design and simulation tools. "The potential of photonics in applications like 5G, IIoT and autonomous vehicles can only be realized by solving immense multiphysics device and system challenges," said James Pond, co-CEO and CTO of Lumerical. "Together, Lumerical and Ansys are uniquely positioned to provide the necessary solutions, and custome... » read more

Chiplet Momentum Rising
By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

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