tag: UMC

The Week In Review: Manufacturing
By Mark LaPedus - 05 Aug, 2016 - Comments: 0

Chipmakers The wearables market has taken another hit. Intel has issued a safety recall for a smartwatch line from its Basis Science subsidiary. "We are issuing this safety recall of the Basis Peak watch because the watch can overheat, which could result in burns or blisters on the skin surface. It is important that you stop using your watch immediately and return it. Although we are stopping ... » read more

The Week In Review: Design
By Jesse Allen - 05 Aug, 2016 - Comments: 0

Tools ProPlus Design Solutions unveiled its 9812DX wafer-level 1/f noise characterization system, an enhanced version of its de facto standard 9812D. It includes a more than 10X increase in system resolution, as well as a speedup boost three-to-five times faster than previous systems, higher voltage support up to 200V, and lower current support down to 0.1nA. It also adds a wider range of me... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jul, 2016 - Comments: 0

Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

Getting The Jump On Analog/RF IP
By Ed Sperling - 26 Jul, 2016 - Comments: 0

When Magma Design was sold to Synopsys in 2012, then-president and COO Roy Jewell sat down with VC Lucio Lanza to figure out what to do next. As Jewell tells it, Lanza convinced him not to take another job. While it’s too early to tell if that was sage advice, it did trigger a search for a new business and a way of funding it. Jewell said that when Magma went looking for money, it raised $... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

200mm Equipment Shortfall
By Mark LaPedus - 21 Jul, 2016 - Comments: 0

A surge in demand for consumer electronics, communications ICs, sensors and other products has created a shortage in 200mm fab capacity that shows no signs of abating. None of these chips need to be manufactured using the most advanced processes, and there have been enough tweaks to processes at established nodes to eke even more out of existing processes. But that has left chipmakers strugg... » read more

Foundry Capacity Investment Led By Taiwan And China
By Clark Tseng - 21 Jul, 2016 - Comments: 0

The era of every company building a captive fab for next-generation products is ancient history, as foundries throughout the world provide leading-edge technology and flexible capacity in a timely and cost-effective manner. In today’s mobile-driven ecosystem, faster product development cycles and time-to-market have become the norm for the industry. Now, this trend is even spreading to the co... » read more

Building Faster Chips
By Ed Sperling - 21 Jul, 2016 - Comments: 5

By Ed Sperling and Jeff Dorsch An explosion in IoT sensor data, the onset of deep learning and AI, and the commercial rollout of augmented and virtual reality are driving a renewed interest in performance as the key metric for semiconductor design. Throughout the past decade in which mobility/smartphone dominated chip design, power replaced performance as the top driver. Processors ha... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jul, 2016 - Comments: 2

Fab materials/tools The Reference Project, a pan-European research program created to develop radio-frequency silicon-on-insulator (RF-SOI) technology, was recently launched at the Bernin, France-based facilities of Soitec. Soitec is the project leader in the group, which has an eligible budget of 33 million euros. The project will focus on developing technologies for 4G+ communications usi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Jul, 2016 - Comments: 0

Fab tools Applied Materials has officially rolled out the Producer Selectra system, a selective etch tool. The system falls under the loosely defined category called atomic layer etch (ALE). Applied’s technology addresses a number of challenges. Today’s advanced chips have complex structures. They may also have deep and narrow trenches. One of the challenges is the inability of wet ... » read more

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