tag: UMC

The Week In Review: Manufacturing
By Mark LaPedus - 09 Sep, 2016 - Comments: 0

Chipmakers GlobalFoundries has rolled out its next-generation FD-SOI technology. The new 12nm FD-SOI process is called 12FDX. It is designed for a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles. "Some applications require the unsurpassed performance of finFET transistors, but the vast majority of connected devices need high l... » read more

The Week In Review: Manufacturing
By Ed Sperling - 26 Aug, 2016 - Comments: 0

Numbers IC Insights predicts TowerJazz and SMIC sales will jump this year, with the total pure-play foundry revenue forecast to grow 9%. That compares with 6% growth last year. TSMC is expected to shrink slightly to 58% market share, with GlobalFoundries staying flat at 11%. UMC will remain in third place in the rankings, followed by SMIC and TowerJazz. SEMI’s book-to-bill ratio jumped to... » read more

Stepping Back From Scaling
By Ed Sperling - 24 Aug, 2016 - Comments: 0

Architectures, packaging and software are becoming core areas for semiconductor research and development, setting the stage for a series of shifts that will impact a large swath of the semiconductor industry. While there is still demand from the largest chipmakers for increased density at the next process node, the underlying economics for foundries, equipment vendors and IP developers are f... » read more

What Transistors Will Look Like At 5nm
By Mark LaPedus - 18 Aug, 2016 - Comments: 3

Chipmakers are currently ramping up 16nm/14nm finFET processes, with 10nm and 7nm just around the corner. The industry also is working on 5nm. TSMC hopes to deliver a 5nm process by 2020. GlobalFoundries, Intel and Samsung are doing R&D for that node. But 5nm technology presents a multitude of unknowns and challenges. For one thing, the exact timing and specs of 5nm remain cloudy. The... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Aug, 2016 - Comments: 0

Chipmakers The wearables market has taken another hit. Intel has issued a safety recall for a smartwatch line from its Basis Science subsidiary. "We are issuing this safety recall of the Basis Peak watch because the watch can overheat, which could result in burns or blisters on the skin surface. It is important that you stop using your watch immediately and return it. Although we are stopping ... » read more

The Week In Review: Design
By Jesse Allen - 05 Aug, 2016 - Comments: 0

Tools ProPlus Design Solutions unveiled its 9812DX wafer-level 1/f noise characterization system, an enhanced version of its de facto standard 9812D. It includes a more than 10X increase in system resolution, as well as a speedup boost three-to-five times faster than previous systems, higher voltage support up to 200V, and lower current support down to 0.1nA. It also adds a wider range of me... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jul, 2016 - Comments: 0

Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

Getting The Jump On Analog/RF IP
By Ed Sperling - 26 Jul, 2016 - Comments: 0

When Magma Design was sold to Synopsys in 2012, then-president and COO Roy Jewell sat down with VC Lucio Lanza to figure out what to do next. As Jewell tells it, Lanza convinced him not to take another job. While it’s too early to tell if that was sage advice, it did trigger a search for a new business and a way of funding it. Jewell said that when Magma went looking for money, it raised $... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

200mm Equipment Shortfall
By Mark LaPedus - 21 Jul, 2016 - Comments: 0

A surge in demand for consumer electronics, communications ICs, sensors and other products has created a shortage in 200mm fab capacity that shows no signs of abating. None of these chips need to be manufactured using the most advanced processes, and there have been enough tweaks to processes at established nodes to eke even more out of existing processes. But that has left chipmakers strugg... » read more

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