tag: UMC

Week In Review: Design, Low Power
By Marie C. Baca - 26 Aug, 2022 - Comments: 0

Quantum computing Baidu introduced a 10-qubit quantum computer called Qianshi and what it described as “the world's first all-platform quantum hardware-software integration solution that provides access to various quantum chips via mobile app, PC, and cloud.” The company said it has also completed the design of a 36-qubit quantum chip. Scientists said “levitating” nanoparticles co... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 26 Aug, 2022 - Comments: 0

Automotive, mobility California will ban the sale of new gasoline vehicles so that by 2035 100% of new cars and light trucks sold in California will be zero-emission vehicles. NXP Semiconductors announced multi-year supply agreements for its S32 family. Agreements to supply the S32 domain and zonal automotive processors to OEMs will include upcoming 5nm ASIL-D processors. Keysight Techno... » read more

Big Changes In Architectures, Transistors, Materials
By Ed Sperling - 18 Aug, 2022 - Comments: 0

Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process steps, increased complexity for each of those steps, and rising costs across the board. At the leading-edge, finFETs will run out of steam somewhere after the 3nm (30 angstrom) node. The three foundries still working at th... » read more

Equipment Suppliers Brace For GaN Market Explosion
By Adele Hars - 18 Aug, 2022 - Comments: 0

A huge GaN market is opening up, driven by consumer devices and the need for greater energy efficiency across many applications. Suppliers are ready, but to fully compete with SiC in high-voltage automotive applications will require further technological developments in power GaN (gallium nitride). Still, the 2020s mark a very high-growth phase for GaN markets. Revenues in the power GaN mark... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 29 Jul, 2022 - Comments: 0

Automotive, mobility Advantest installed its first enhanced T5851-STM16G tester of nonvolatile memory express (NVMe) solid-state drives (SSDs) using ball-grid arrays (BGAs) at a major manufacturer of IC memory devices. Anticipating the automotive market will be the largest consumer semiconductor ICs, Advantest designed the test machine to give system-level test coverage of NVMe BGA SSD devices... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Week In Review, Manufacturing, Test
By Susan Rambo - 08 Jul, 2022 - Comments: 0

The U.S. is attempting to restrict sales of ASML’s deep ultra-violet (DUV) litho systems to China, according to a report from Bloomberg. The U.S. has been working to limit China's access to advanced technology for some time, and it has already limited sales of extreme ultra-violet (EUV), which is used to develop chips at the most advanced process nodes. DUV, in contrast, is used for older-nod... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Jul, 2022 - Comments: 0

IP, design Arm unveiled a number of new CPUs and GPUs. Based on the Armv9 architecture, the Cortex-X3 aims to improve single-threaded performance and targets a range of benchmarks and applications. The Cortex-A715 focuses on efficient performance, delivering a 20% energy efficiency gain and 5% performance uplift compared to Cortex-A710. In addition, the Cortex-A510 and DSU-110 were updated to ... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 24 Jun, 2022 - Comments: 0

Notes from the fabs Intel warned the “scope and pace" of the Ohio fab buildout could be impacted due to U.S. Congress’ inaction on funding the $52 billion CHIPS Act. The facility was announced in January with an initial phase investment of more than $20 billion with a larger expansion up to $100 billion over the next decade. The initial phase is not expected to be impacted, other than a de... » read more

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