tag: UMC

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Week In Review, Manufacturing, Test
By Susan Rambo - 08 Jul, 2022 - Comments: 0

The U.S. is attempting to restrict sales of ASML’s deep ultra-violet (DUV) litho systems to China, according to a report from Bloomberg. The U.S. has been working to limit China's access to advanced technology for some time, and it has already limited sales of extreme ultra-violet (EUV), which is used to develop chips at the most advanced process nodes. DUV, in contrast, is used for older-nod... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Jul, 2022 - Comments: 0

IP, design Arm unveiled a number of new CPUs and GPUs. Based on the Armv9 architecture, the Cortex-X3 aims to improve single-threaded performance and targets a range of benchmarks and applications. The Cortex-A715 focuses on efficient performance, delivering a 20% energy efficiency gain and 5% performance uplift compared to Cortex-A710. In addition, the Cortex-A510 and DSU-110 were updated to ... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 24 Jun, 2022 - Comments: 0

Notes from the fabs Intel warned the “scope and pace" of the Ohio fab buildout could be impacted due to U.S. Congress’ inaction on funding the $52 billion CHIPS Act. The facility was announced in January with an initial phase investment of more than $20 billion with a larger expansion up to $100 billion over the next decade. The initial phase is not expected to be impacted, other than a de... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 29 Apr, 2022 - Comments: 0

It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Photomask Shortages Grow At Mature Nodes
By Mark LaPedus - 21 Apr, 2022 - Comments: 2

A surge in demand for chips at mature nodes, coupled with aging photomask-making equipment at those geometries, are causing significant concern across the supply chain. These issues began to surface only recently, but they are particularly worrisome for photomasks, which are critical for chip production. Manufacturing capacity is especially tight for photomasks at 28nm and above, driving up ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Mar, 2022 - Comments: 0

Chipmakers, OEMs Intel continues to build more fabs. First, the company announced fabs in Arizona and then Ohio. Now, Intel plans to invest up to €80 billion in the European Union over the next decade. As part of the effort, Intel plans to build two semiconductor fabs in Magdeburg, Germany. Construction is expected to begin in the first half of 2023 and production planned to come online in 2... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Mar, 2022 - Comments: 0

Alphawave IP will acquire the OpenFive business unit from SiFive. The $210 million cash deal will bring OpenFive’s high-speed connectivity SoC IP portfolio to Alphawave and nearly double its IPs currently available, including an expanded die-to-die connectivity portfolio as well as adding data center and networking custom silicon solutions. "When we completed our IPO in 2021, we committed to ... » read more

Chiplets Enter The Supercomputer Race
By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Feb, 2022 - Comments: 0

Chipmakers, OEMs UMC plans to build a new fab next to its existing 300mm fab in Singapore. The new fab, called Fab12i P3, will manufacture wafers based on UMC’s 22nm/28nm processes. The planned investment for this project will be $5 billion. The first phase of this greenfield fab will have a monthly capacity of 30,000 wafers with production expected to commence in late 2024. To account fo... » read more

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