Chip Industry Technical Paper Roundup: Apr. 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=419 /] Find more semiconductor research papers here. » read more

Emerging Cybersecurity Risks in Connected Vehicles, With Focus On In-Vehicle and Vehicle-Edge Platforms


A new technical paper titled "Security Risks and Designs in the Connected Vehicle Ecosystem: In-Vehicle and Edge Platforms" was published by researchers at Università di Pisa, Ford Motor Company, MIT, and the Institute of Informatics and Telematics (Pisa). Abstract "The evolution of Connected Vehicles (CVs) has introduced significant advancements in both in-vehicle and vehicle-edge platfor... » read more

Chip Industry Technical Paper Roundup: Feb. 18


New technical papers recently added to Semiconductor Engineering’s library: [table id=406 /] Find all technical papers here. » read more

Simulation Study Of Vertically Stacked 2D NSFETs


A new technical paper titled "Simulation of Vertically Stacked 2-D Nanosheet FETs" was published by researchers at Università di Pisa and TU Wien. Abstract "We present a simulation study of vertically stacked 2-D nanosheet field-effect transistors (NSFETs). The aim of this investigation is to assess the performance and potential of FinFET alternatives, i.e., gate-all-around (GAA) nanosheet... » read more