New lithography tools will be required at 5nm, but pellicles, resists and uptime are still problematic.

Industrial IoT now dominates the market, but confusion is still rampant in all sectors.

OneSpin’s CEO looks at what’s needed in this computing space, which technologies are winning, and what the key metrics will be.

Dynamic, thermal, packaging and electromagnetic effects grow, and so do the interactions between all of them.

Kobe Steel scandal; GF’s auto portfolio; AI, SOI at S3S.

Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips are incorporated into industrial and automotive applications.

Focus is on cutting costs across the board, and it turns out there is still quite a bit to cut.

Device degradation becomes limiting factor in IC scaling, and a significant challenge in advanced SoCs.

How cost-sensitive are IoT edge devices, what are the real drivers for this industry, and what is the impact on EDA and IP?

Part 2: For the IP industry to remain healthy it has to constantly innovate, but it’s getting harder.

Just relying on faster processor clock speeds isn’t sufficient for vision processing, and the idea is spreading to other markets.

The answer appears to be a resounding no, but innovation isn’t necessarily happening in the same places as in the past.

Dynamic, thermal, packaging and electromagnetic effects grow, and so do the interactions between all of them.