Chip Industry Technical Paper Roundup: Sept. 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=256 /] More ReadingTechnical Paper Library home » read more

Characterizing Three Supercomputers: Multi-GPU Interconnect Performance


A new technical paper titled "Exploring GPU-to-GPU Communication: Insights into Supercomputer Interconnects" was published by researchers at Sapienza University of Rome, University of Trento, Vrije Universiteit Amsterdam, ETH Zurich, CINECA, University of Antwerp, IBM Research Europe, HPE Cray, and NVIDIA. Abstract "Multi-GPU nodes are increasingly common in the rapidly evolving landscape... » read more

Manufacturing Bits: Oct. 27


CD-SAXS makes progress For years, chipmakers have used metrology tools based on various optical techniques, such as scatterometry. But optical-based scatterometry may one day run out of steam, prompting the need for a possible replacement. One long-awaited candidate is called X-ray scattering. There are various flavors of X-ray scattering, including CD small-angle X-ray scattering (CD-SAXS)... » read more