System Bits: Sept. 16

By Ann Mutschler - 16 Sep, 2014 - Comments: 0

Increasing optical storage capacity with holograms Researchers from the University of Cambridge have developed a new method for making multi-colored holograms from a thin film of silver nanoparticles, which they say could greatly increase the storage capabilities of typical optical storage devices. The interference produced by the interaction of light with the nanoparticles allows the holog... » read more

Power/Performance Bits: June 17

By Ann Mutschler - 17 Jun, 2014 - Comments: 0

Nanotubes boost terahertz detectors Researchers at Rice University, Sandia National Laboratories and the Tokyo Institute of Technology have developed novel terahertz detectors based on carbon nanotubes that could improve medical imaging, airport passenger screening, food inspection and other applications. Unlike current terahertz detectors, the devices are flexible, sensitive to polarizatio... » read more

Power/Performance Bits: Feb. 11

By Ann Mutschler - 11 Feb, 2014 - Comments: 0

Low-power chip for cochlear implants without external hardware Existing versions of cochlear implants require that a disk-shaped transmitter about an inch in diameter be affixed to the skull, with a wire snaking down to a joint microphone and power source that looks like an oversized hearing aid around the patient’s ear...until now. Researchers at MIT’s Microsystems Technology Laboratory a... » read more

Power/Performance Bits: Jan. 21

By Ann Mutschler - 21 Jan, 2014 - Comments: 0

Spinning towards superconduction With spintronics widely believed to be the basis of a future revolution in computing, researchers at the University of Cambridge are reporting what they said is the first evidence that superconductors could be used as an energy-efficient source for so-called “spin-based” devices, which are already starting to appear in electronic devices. Spintronic devi... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of Cambridge

System Bits: Sept. 16

Power/Performance Bits: June 17

Power/Performance Bits: Feb. 11

Power/Performance Bits: Jan. 21

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