tag: University of Edinburgh

Die-level Thinning and Integrating Route For Singulated MPW Chips Using Both Silicon Sensors and CMOS Devices
By Technical Paper Link - 30 Apr, 2022 - Comments: 0

Abstract "Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an el... » read more

Vector Runahead
By Technical Paper Link - 19 Aug, 2021 - Comments: 0

Abstract: "The memory wall places a significant limit on performance for many modern workloads. These applications feature complex chains of dependent, indirect memory accesses, which cannot be picked up by even the most advanced microarchitectural prefetchers. The result is that current out-of-order superscalar processors spend the majority of their time stalled. While it is possible to bui... » read more

Blog Review: Jan. 13
By Jesse Allen - 13 Jan, 2021 - Comments: 0

Siemens EDA's Harry Foster tracks trends in IC and ASIC design and finds that increased design size is only one dimension of the growing complexity challenge. Synopsys' Chris Clark and Dennis Kengo Oka predicts how the automotive industry will change in 2021, including new standards for security, increased use of AI and V2X technologies, and a growing focus on software. Cadence's Paul McL... » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Oct, 2020 - Comments: 0

M&A AMD will acquire Xilinx for $35 billion in an all-stock deal. "Joining together with AMD will help accelerate growth in our data center business and enable us to pursue a broader customer base across more markets,” said Victor Peng, Xilinx president and CEO. The deal is expected to close by the end of 2021. The acquisition of the programmable logic giant will leave only a few purepla... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 30 Oct, 2020 - Comments: 0

Automotive Synopsys added support for Infineon's automotive AI chip, the AURIX TC4xx 32-bit microcontroller with parallel processing unit. Dialog Semiconductor announced automotive qualification for its DA7280 high-definition haptic driver. The company Alps Alpine is using the DA7280 in Alps Alpine Heavy, the latest version of its HAPTIC Reactor Linear Resonant Actuators (LRAs). Bosch, M... » read more

System Bits: July 23
By Jeff Dorsch - 23 Jul, 2019 - Comments: 0

Superconductivity seen in trilayer graphene Stanford University and University of California at Berkeley researchers discovered signs of superconductivity in stacking three-layer sheets of graphene, they report. “It’s definitely an exciting development,” says Cory Dean, a physicist at Columbia University. Dean notes that bilayer graphene superconducts only when the atomic lattices of ... » read more

Power/Performance Bits: Feb. 11
By Jesse Allen - 11 Feb, 2019 - Comments: 0

Body heat harvesting Chemists at the University of Massachusetts Amherst developed a fabric that can harvest body heat to power small wearable electronics such as activity trackers. The device works on the thermoelectric effect created by body temperature and ambient cooler air. "What we have developed is a way to inexpensively vapor-print biocompatible, flexible and lightweight polymer fil... » read more

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