Blog Review: Jan. 13

By Jesse Allen - 13 Jan, 2021 - Comments: 0

Siemens EDA's Harry Foster tracks trends in IC and ASIC design and finds that increased design size is only one dimension of the growing complexity challenge. Synopsys' Chris Clark and Dennis Kengo Oka predicts how the automotive industry will change in 2021, including new standards for security, increased use of AI and V2X technologies, and a growing focus on software. Cadence's Paul McL... » read more

Week In Review: Design, Low Power

By Jesse Allen - 30 Oct, 2020 - Comments: 0

M&A AMD will acquire Xilinx for $35 billion in an all-stock deal. "Joining together with AMD will help accelerate growth in our data center business and enable us to pursue a broader customer base across more markets,” said Victor Peng, Xilinx president and CEO. The deal is expected to close by the end of 2021. The acquisition of the programmable logic giant will leave only a few purepla... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 30 Oct, 2020 - Comments: 0

Automotive Synopsys added support for Infineon's automotive AI chip, the AURIX TC4xx 32-bit microcontroller with parallel processing unit. Dialog Semiconductor announced automotive qualification for its DA7280 high-definition haptic driver. The company Alps Alpine is using the DA7280 in Alps Alpine Heavy, the latest version of its HAPTIC Reactor Linear Resonant Actuators (LRAs). Bosch, M... » read more

System Bits: July 23

By Jeff Dorsch - 23 Jul, 2019 - Comments: 0

Superconductivity seen in trilayer graphene Stanford University and University of California at Berkeley researchers discovered signs of superconductivity in stacking three-layer sheets of graphene, they report. “It’s definitely an exciting development,” says Cory Dean, a physicist at Columbia University. Dean notes that bilayer graphene superconducts only when the atomic lattices of ... » read more

Power/Performance Bits: Feb. 11

By Jesse Allen - 11 Feb, 2019 - Comments: 0

Body heat harvesting Chemists at the University of Massachusetts Amherst developed a fabric that can harvest body heat to power small wearable electronics such as activity trackers. The device works on the thermoelectric effect created by body temperature and ambient cooler air. "What we have developed is a way to inexpensively vapor-print biocompatible, flexible and lightweight polymer fil... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of Edinburgh

Blog Review: Jan. 13

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

System Bits: July 23

Power/Performance Bits: Feb. 11