tag: University of Edinburgh

Chip Industry’s Technical Paper Roundup: Sept 19
By Liz Allan - 19 Sep, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=141 /] More Reading Technical Paper Library home » read more

SG2042 64-Core RISC-V CPU Versus Existing RISC-V HW And High Performance x86 CPUs
By Technical Paper Link - 13 Sep, 2023 - Comments: 0

A technical paper titled “Is RISC-V ready for HPC prime-time: Evaluating the 64-core Sophon SG2042 RISC-V CPU” was published by researchers at University of Edinburgh. Abstract: "The Sophon SG2042 is the world's first commodity 64-core RISC-V CPU for high performance workloads and an important question is whether the SG2042 has the potential to encourage the HPC community to embrace RISC-... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 16 Jun, 2023 - Comments: 0

The European Parliament took a major step toward enacting the world’s first laws around the use of AI. Known as the AI Act, the draft law won a majority vote following two years of debate. If the proposed regulations pass the next hurdles, AI systems posing an unacceptable risk to human safety would be banned — along with “intrusive and discriminatory” uses of AI, including biometric su... » read more

Chip Industry’s Technical Paper Roundup: May 2
By Linda Christensen - 02 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=95 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

RISC-V Vectorization And Potential for HPC
By Technical Paper Link - 26 Apr, 2023 - Comments: 0

A new technical paper titled "Test-driving RISC-V Vector hardware for HPC" was published by researchers at University of Edinburgh. Abstract: "Whilst the RISC-V Vector extension (RVV) has been ratified, at the time of writing both hardware implementations and open source software support are still limited for vectorisation on RISC-V. This is important because vectorisation is crucial to obt... » read more

Technical Paper Round-up: May 3
By Linda Christensen - 03 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=24 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Die-level Thinning and Integrating Route For Singulated MPW Chips Using Both Silicon Sensors and CMOS Devices
By Technical Paper Link - 30 Apr, 2022 - Comments: 0

Abstract "Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an el... » read more

Vector Runahead
By Technical Paper Link - 19 Aug, 2021 - Comments: 0

Abstract: "The memory wall places a significant limit on performance for many modern workloads. These applications feature complex chains of dependent, indirect memory accesses, which cannot be picked up by even the most advanced microarchitectural prefetchers. The result is that current out-of-order superscalar processors spend the majority of their time stalled. While it is possible to bui... » read more

Blog Review: Jan. 13
By Jesse Allen - 13 Jan, 2021 - Comments: 0

Siemens EDA's Harry Foster tracks trends in IC and ASIC design and finds that increased design size is only one dimension of the growing complexity challenge. Synopsys' Chris Clark and Dennis Kengo Oka predicts how the automotive industry will change in 2021, including new standards for security, increased use of AI and V2X technologies, and a growing focus on software. Cadence's Paul McL... » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Oct, 2020 - Comments: 0

M&A AMD will acquire Xilinx for $35 billion in an all-stock deal. "Joining together with AMD will help accelerate growth in our data center business and enable us to pursue a broader customer base across more markets,” said Victor Peng, Xilinx president and CEO. The deal is expected to close by the end of 2021. The acquisition of the programmable logic giant will leave only a few purepla... » read more

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