tag: University of Tokyo

Research Bits: June 13
By Jesse Allen - 13 Jun, 2023 - Comments: 0

Converting heat to electricity Researchers at the National Institute of Standards and Technology (NIST) and University of Colorado Boulder fabricated a device to boost the conversion of heat into electricity. The technique involves depositing hundreds of thousands of microscopic columns of gallium nitride atop a silicon wafer. Layers of silicon are then removed from the underside of the waf... » read more

Week In Review: Design, Low Power
By Karen Heyman - 26 May, 2023 - Comments: 0

Cadence bought Pulsic, a U.K.-based developer of place-and-route tools for custom digital and analog. The acquisition follows a previous acquisition attempt by a Chinese firm in August 2022, which was blocked by the U.K. government. At the G7 Summit in Japan, IBM announced a 10-year, $100 million initiative with the University of Tokyo and the University of Chicago to develop a quantum-centr... » read more

Week In Review: Design, Low Power
By Susan Rambo - 19 May, 2023 - Comments: 0

Design Ansys has signed a definitive agreement to acquire EDA tool company Diakopto. Diakopto specializes in software tools that find the cause of layout parasitics. Its products are ParagonX, for analyzing and debugging IC designs and layout parasitics, and EM/IR analysis/verification tool PrimeX. The deal is expected to close in the second quarter of 2023. SEMI’s FlexTech community issu... » read more

Chip Industry’s Technical Paper Roundup: May 2
By Linda Christensen - 02 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=95 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Hardware-Accelerated RTL Simulator
By Technical Paper Link - 26 Apr, 2023 - Comments: 0

A technical paper titled "Manticore: Hardware-Accelerated RTL Simulation with Static Bulk-Synchronous Parallelism" was published by researchers at EPFL, University of Tokyo, Sharif University, and Indian Institute of Technology. Abstract "The demise of Moore's Law and Dennard Scaling has revived interest in specialized computer architectures and accelerators. Verification and testing of thi... » read more

Research Bits: Feb. 28
By Susan Rambo - 28 Feb, 2023 - Comments: 0

Single-molecule switch An international team of researchers have demonstrated a switch on a single fullerene molecule. Using a laser, the team switched the path of an incoming electron. “What we’ve managed to do here is control the way a molecule directs the path of an incoming electron using a very short pulse of red laser light,” said Project Researcher Hirofumi Yanagisawa from the Uni... » read more

Chip Industry’s Technical Paper Roundup: Feb. 28
By Linda Christensen - 28 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=83 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Research Bits: Oct. 25
By Jesse Allen - 25 Oct, 2022 - Comments: 0

Polarization for photonic processor Researchers from the University of Oxford and University of Exeter developed a photonic processor that uses multiple polarization channels, increasing information density. "We all know that the advantage of photonics over electronics is that light is faster and more functional over large bandwidths. So, our aim was to fully harness such advantages of phot... » read more

Research Bits: Oct. 18
By Jesse Allen - 18 Oct, 2022 - Comments: 0

Modular AI chip Engineers at the Massachusetts Institute of Technology (MIT), Harvard University, Stanford University, Lawrence Berkeley National Laboratory, Korea Institute of Science and Technology, and Tsinghua University created a modular approach to building stackable, reconfigurable AI chips. The design comprises alternating layers of sensing and processing elements, along with LEDs t... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 14 Oct, 2022 - Comments: 0

Automotive, Mobility Hyundai announced all of its vehicles will be software-defined vehicles (SDVs) by 2025. The company said all newly launched Hyundai vehicles will be able to receive over-the-air software updates next year, and that it expects to register 20 million vehicles to its Connected Car Services system by 2025. Hyundai also said it will invest the equivalent of more than $12 billio... » read more

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