tag: University of Tsukuba

Wafer Bonding Mechanisms Using SiCN Films For Hybrid Bonding Applications In 3D Integration 
By Technical Paper Link - 24 Jun, 2025 - Comments: 0

A new technical paper titled "Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration" was published by researchers at Yokohama National University, TEL, SK hynix, and University of Tsukuba. According to the paper: "Although much research has been conducted on wafer bonding methods compatible with the latest semiconductor manufacturing processes, discussions on the interface... » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Research Bits: September 26
By Jesse Allen - 26 Sep, 2023 - Comments: 0

2D waveguides Researchers from the University of Chicago found that a sheet of glass crystal just a few atoms thick could trap and carry light efficiently up to a centimeter. In tests, the researchers found they could use extremely tiny prisms, lenses, and switches to guide the path of the light along a chip. “We were utterly surprised by how powerful this super-thin crystal is; not on... » read more

Chip Industry’s Technical Paper Roundup: Sept 19
By Liz Allan - 19 Sep, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=141 /] More Reading Technical Paper Library home » read more

A Perovskite-Derivative Nickelate Offering More Durable, Sustainable Multi-Level Non-Volatile Phase Change Memory
By Technical Paper Link - 13 Sep, 2023 - Comments: 0

A technical paper titled “Thermally Reentrant Crystalline Phase Change in Perovskite-Derivative Nickelate Enabling Reversible Switching of Room-Temperature Electrical Resistivity” was published by researchers at Tohoku University and University of Tsukuba. Abstract: "Reversible switching of room-temperature electrical resistivity due to crystal-amorphous transition is demonstrated in vari... » read more

Research Bits: August 15
By Jesse Allen - 15 Aug, 2023 - Comments: 0

Using noise for spintronics Researchers from the Institute for Basic Science built a vertical magnetic tunneling junction device by sandwiching a few layers of vanadium in tungsten diselenide (V-WSe2), a magnetic material, between top and bottom graphene electrodes to create high-amplitude Random Telegraph Noise (RTN) signals. Through the resistance measurement experiments using these devic... » read more

Chip Industry’s Technical Paper Roundup: Feb. 28
By Linda Christensen - 28 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=83 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Fast Time-Resolved Scanning Tunneling Microscopy (STM) for Nanostructures
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Externally-triggerable optical pump-probe scanning tunneling microscopy with a time resolution of tens-picosecond" was published by researchers at University of Tsukuba and UNISOKU Co. According to the U. of Tsukaba news article, "OPP STM is an essential method for measuring photo-induced charge carrier dynamics in nanostructures, but requires technical advances... » read more

Week In Review: Manufacturing, Test
By Gregory Haley - 24 Feb, 2023 - Comments: 0

The U.S. is aiming for the creation of two new advanced semiconductor manufacturing facilities with “a robust supplier ecosystem” supported by the $52.7 billion CHIPS Act. Included is an $11 billion investment in semiconductor research and development, along with the creation of a new public-private partnership called the National Semiconductor Technology Center. This follows more than a do... » read more

Power/Performance Bits: July 28
By Jesse Allen - 28 Jul, 2020 - Comments: 0

Programmable photonics Researchers from the University of Southampton developed a method for making programmable  integrated switching units on a silicon photonics chip. By using a generic optical circuit that can be fabricated in bulk then later programmed for specific applications, the team hopes to reduce production costs. "Silicon photonics is capable of integrating optical devices and... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy