Manufacturing Bits: Dec. 13

By Mark LaPedus - 13 Dec, 2016 - Comments: 0

Phonon lasers A European consortium recently kicked off a new project that will develop a practical phonon laser. The European consortium, called PHENOMEN, will be coordinated by the Catalan Institute of Nanoscience and Nanotechnology (ICN2). Most chips perform functions using an electrical charge (electrons) or by light (photons). In comparison, a phonon “is a quantum of energy or a q... » read more

Manufacturing Bits: March 1

By Mark LaPedus - 01 Mar, 2016 - Comments: 0

Gravitational-wave observatories India has approved the construction of the world’s third gravitational-wave observatory. This facility will replicate the two Laser Interferometer Gravitational-wave Observatories (LIGOs) in the United States, which recently detected the world's first gravitational waves. The Indian project, dubbed LIGO-India, is expected to go online in 2023. The effort b... » read more

Power/Performance Bits: Dec. 16

By Ann Mutschler - 16 Dec, 2014 - Comments: 0

Measuring electrons in silicon In what is believed to be a first, a team of physicists and chemists based at UC Berkeley, Ludwig-Maximilians Universität in Munich, Germany, the University of Tsukuba, Japan, and the Molecular Foundry at the Department of Energy’s Lawrence Berkeley National Laboratory has captured images of electrons breaking free of their atomic shells using attosecond pulse... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of Tsukuba

Manufacturing Bits: Dec. 13

Manufacturing Bits: March 1

Power/Performance Bits: Dec. 16

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