Chip Industry Technical Paper Roundup: July 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=426 /] Find more semiconductor research papers here. » read more

Wafer Bonding Mechanisms Using SiCN Films For Hybrid Bonding Applications In 3D Integration 


A new technical paper titled "Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration" was published by researchers at Yokohama National University, TEL, SK hynix, and University of Tsukuba. According to the paper: "Although much research has been conducted on wafer bonding methods compatible with the latest semiconductor manufacturing processes, discussions on the interface... » read more

Chip Industry Week In Review


Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Research Bits: September 26


2D waveguides Researchers from the University of Chicago found that a sheet of glass crystal just a few atoms thick could trap and carry light efficiently up to a centimeter. In tests, the researchers found they could use extremely tiny prisms, lenses, and switches to guide the path of the light along a chip. “We were utterly surprised by how powerful this super-thin crystal is; not on... » read more

Chip Industry’s Technical Paper Roundup: Sept 19


New technical papers added to Semiconductor Engineering’s library this week. [table id=141 /] More Reading Technical Paper Library home » read more

A Perovskite-Derivative Nickelate Offering More Durable, Sustainable Multi-Level Non-Volatile Phase Change Memory


A technical paper titled “Thermally Reentrant Crystalline Phase Change in Perovskite-Derivative Nickelate Enabling Reversible Switching of Room-Temperature Electrical Resistivity” was published by researchers at Tohoku University and University of Tsukuba. Abstract: "Reversible switching of room-temperature electrical resistivity due to crystal-amorphous transition is demonstrated in vari... » read more

Research Bits: August 15


Using noise for spintronics Researchers from the Institute for Basic Science built a vertical magnetic tunneling junction device by sandwiching a few layers of vanadium in tungsten diselenide (V-WSe2), a magnetic material, between top and bottom graphene electrodes to create high-amplitude Random Telegraph Noise (RTN) signals. Through the resistance measurement experiments using these devic... » read more

Chip Industry’s Technical Paper Roundup: Feb. 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=83 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Fast Time-Resolved Scanning Tunneling Microscopy (STM) for Nanostructures


A new technical paper titled "Externally-triggerable optical pump-probe scanning tunneling microscopy with a time resolution of tens-picosecond" was published by researchers at University of Tsukuba and UNISOKU Co. According to the U. of Tsukaba news article, "OPP STM is an essential method for measuring photo-induced charge carrier dynamics in nanostructures, but requires technical advances... » read more

Week In Review: Manufacturing, Test


The U.S. is aiming for the creation of two new advanced semiconductor manufacturing facilities with “a robust supplier ecosystem” supported by the $52.7 billion CHIPS Act. Included is an $11 billion investment in semiconductor research and development, along with the creation of a new public-private partnership called the National Semiconductor Technology Center. This follows more than a do... » read more

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