Chip Industry Week in Review


China's Xiaomi debuted an in-house-designed 10-core mobile SoC built on a 3nm process. The company did not identify the foundry. It also announced plans to invest 50 billion yuan (~$7B) over the next decade to develop high-end smartphone chips, as part of a 200 billion yuan (~$28B) core technology investment over the next five years. Kearney and SEMI released a report assessing the state of ... » read more

Chip Industry Technical Paper Roundup: May 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=430 /] Find more semiconductor research papers here.   » read more

Safety Architecture and Approaches for Automotive SW And HW Including ASIL D And AI/ML (Mercedes-Benz, U. Of Washington)


A new technical paper titled "Key Safety Design Overview in AI-driven Autonomous Vehicles" was published by researchers at Mercedes-Benz Research and Development North America and University of Washington . Abstract "With the increasing presence of autonomous SAE level 3 and level 4, which incorporate artificial intelligence software, along with the complex technical challenges they present... » read more

Chip Industry Technical Paper Roundup: Feb. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

HW-Aligned Sparse Attention Architecture For Efficient Long-Context Modeling (DeepSeek et al.)


A new technical paper titled "Native Sparse Attention: Hardware-Aligned and Natively Trainable Sparse Attention" was published by DeepSeek, Peking University and University of Washington. Abstract "Long-context modeling is crucial for next-generation language models, yet the high computational cost of standard attention mechanisms poses significant computational challenges. Sparse attention... » read more

Chip Industry Technical Paper Roundup: Feb. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=403 /] Find all technical papers here. » read more

Security Technical Paper Roundup: Aug. 27


A number of hardware security-related technical papers were presented at the August 2024 USENIX Security Symposium. The organization provides open access research, and the presentation slides and papers are free to the public. Topics include side-channel attacks and defenses, embedded security, fuzzing, fault injection, logic locking, Rowhammer, and more. Here are some highlights with associate... » read more

Data Memory-Dependent Prefetchers Pose SW Security Threat By Breaking Cryptographic Implementations


A technical paper titled “GoFetch: Breaking Constant-Time Cryptographic Implementations Using Data Memory-Dependent Prefetchers” was presented at the August 2024 USENIX Security Symposium by researchers at University of Illinois Urbana-Champaign, University of Texas at Austin, Georgia Institute of Technology, University of California Berkeley, University of Washington, and Carnegie Mellon U... » read more

Chip Industry Technical Paper Roundup: July 30


New technical papers recently added to Semiconductor Engineering’s library, including a best paper award winner at ISCA. [table id=246 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

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