tag: University of Wisconsin-Madison

Chip Industry Technical Paper Roundup: Oct. 22
By Linda Christensen - 22 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=371 /]   More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 18 Oct, 2024 - Comments: 0

Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

Thermal Modeling For 2.5D And 3D Integrated Chiplets
By Technical Paper Link - 16 Oct, 2024 - Comments: 0

A new technical paper titled "MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures" was published by researchers at University of Wisconsin–Madison, Washington State University, and University of Ulsan. Abstract: "Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D d... » read more

Chip Industry Technical Paper Roundup: Dec 18
By Linda Christensen - 18 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=176 /] More ReadingTechnical Paper Library home » read more

A Survey Of Recent Advances In Spiking Neural Networks From Algorithms To HW Acceleration
By Technical Paper Link - 13 Dec, 2023 - Comments: 0

A technical paper titled “Recent Advances in Scalable Energy-Efficient and Trustworthy Spiking Neural networks: from Algorithms to Technology” was published by researchers at Intel Labs, University of California Santa Cruz, University of Wisconsin-Madison, and University of Southern California. Abstract: "Neuromorphic computing and, in particular, spiking neural networks (SNNs) have becom... » read more

Designing Low Power Radar Processors
By Technical Paper Link - 12 Dec, 2023 - Comments: 0

A technical paper titled “Ellora: Exploring Low-Power OFDM-based Radar Processors using Approximate Computing” was published by researchers at University of California Irvine, University of Wisconsin-Madison, and TCS Research. Abstract: "In recent times, orthogonal frequency-division multiplexing (OFDM)-based radar has gained wide acceptance given its applicability in joint radar-communic... » read more

Week In Review: Manufacturing, Test
By Gregory Haley - 24 Feb, 2023 - Comments: 0

The U.S. is aiming for the creation of two new advanced semiconductor manufacturing facilities with “a robust supplier ecosystem” supported by the $52.7 billion CHIPS Act. Included is an $11 billion investment in semiconductor research and development, along with the creation of a new public-private partnership called the National Semiconductor Technology Center. This follows more than a do... » read more

Chip Industry’s Technical Paper Roundup: Jan. 17
By Linda Christensen - 17 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

New Technique For Making Thin Films of Perovskite Oxide Semiconductors
By Technical Paper Link - 06 Jan, 2023 - Comments: 0

A technical paper titled "Freestanding epitaxial SrTiO3  nanomembranes via remote epitaxy using hybrid molecular beam epitaxy" was published by researchers at University of Minnesota Twin Cities, Pacific Northwest National Laboratory, and University of Wisconsin–Madison. The researchers developed a new technique for making thin films of perovskite oxide semiconductors.  The development c... » read more

Technical Paper Roundup: Sept. 12
By Linda Christensen - 12 Sep, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=51 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

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