tag: University of Wisconsin-Madison

Chip Industry Technical Paper Roundup: Apr. 7
By Linda Christensen - 07 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=419 /] Find more semiconductor research papers here. » read more

Photonic-SRAM Bitcell for High-Speed On-Chip Photonic Memory and Compute Systems (UW, USC, GF)
By Technical Paper Link - 04 Apr, 2025 - Comments: 0

A new technical paper titled "Design of Energy-Efficient Cross-coupled Differential Photonic-SRAM (pSRAM) Bitcell for High-Speed On-Chip Photonic Memory and Compute Systems" was published by researchers at University of Wisconsin–Madison, USC and GlobalFoundries. Abstract "In this work, we propose a novel differential photonic static random access memory (pSRAM) bitcell design using fabri... » read more

High-Temperature Nonreciprocal Thermal Radiative Properties From Semiconductors (U. Houston, Caltech, UW-Madison)
By Technical Paper Link - 12 Feb, 2025 - Comments: 0

A new technical paper titled "High-Temperature Strong Nonreciprocal Thermal Radiation from Semiconductors" was published by University of Houston, California Institute of Technology and University of Wisconsin-Madison. Abstract "Nonreciprocal thermal emitters that break the conventional Kirchhoff's law allow independent control of emissivity and absorptivity and promise exciting new funct... » read more

Chip Industry Technical Paper Roundup: Oct. 22
By Linda Christensen - 22 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=371 /]   More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 18 Oct, 2024 - Comments: 0

Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

Thermal Modeling For 2.5D And 3D Integrated Chiplets
By Technical Paper Link - 16 Oct, 2024 - Comments: 0

A new technical paper titled "MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures" was published by researchers at University of Wisconsin–Madison, Washington State University, and University of Ulsan. Abstract: "Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D d... » read more

Chip Industry Technical Paper Roundup: Dec 18
By Linda Christensen - 18 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=176 /] More ReadingTechnical Paper Library home » read more

A Survey Of Recent Advances In Spiking Neural Networks From Algorithms To HW Acceleration
By Technical Paper Link - 13 Dec, 2023 - Comments: 0

A technical paper titled “Recent Advances in Scalable Energy-Efficient and Trustworthy Spiking Neural networks: from Algorithms to Technology” was published by researchers at Intel Labs, University of California Santa Cruz, University of Wisconsin-Madison, and University of Southern California. Abstract: "Neuromorphic computing and, in particular, spiking neural networks (SNNs) have becom... » read more

Designing Low Power Radar Processors
By Technical Paper Link - 12 Dec, 2023 - Comments: 0

A technical paper titled “Ellora: Exploring Low-Power OFDM-based Radar Processors using Approximate Computing” was published by researchers at University of California Irvine, University of Wisconsin-Madison, and TCS Research. Abstract: "In recent times, orthogonal frequency-division multiplexing (OFDM)-based radar has gained wide acceptance given its applicability in joint radar-communic... » read more

Week In Review: Manufacturing, Test
By Gregory Haley - 24 Feb, 2023 - Comments: 0

The U.S. is aiming for the creation of two new advanced semiconductor manufacturing facilities with “a robust supplier ecosystem” supported by the $52.7 billion CHIPS Act. Included is an $11 billion investment in semiconductor research and development, along with the creation of a new public-private partnership called the National Semiconductor Technology Center. This follows more than a do... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy