Manufacturing Bits: Nov. 18

By Mark LaPedus - 18 Nov, 2014 - Comments: 0

Street light EV charging stations Looking for a place to re-charge an electric car on the road? BMW has developed one possible solution, at least in Europe. The automotive giant has demonstrated a street lighting system that doubles as a charging station for electric vehicles. Part of a pilot project called Light and Charge, the first two prototype systems have moved into operation at BMW W... » read more

Power/Performance Bits: June 3

By Ann Mutschler - 03 Jun, 2014 - Comments: 0

Stabilizing common semiconductors for solar fuels generation Researchers around the world are trying to develop solar-driven generators that can split water, yielding hydrogen gas that could be used as clean fuel. These devices would require efficient light-absorbing materials that attract and hold sunlight to drive the chemical reactions involved in water splitting. As semiconductors like sil... » read more

Manufacturing Bits: April 29

By Mark LaPedus - 29 Apr, 2014 - Comments: 0

Silky e-beam lithography Tufts University has put a soft and silky spin on direct-write electron-beam lithography. Researchers used common silk as the resist material, enabling the production of photonic lattices, quantum dots and other structures. This approach is a green alternative to traditional and toxic resists. The silk-based resist is developed using a water-based process. It starts... » read more

Grappling With Graphene

By Brian Fuller - 11 Mar, 2010 - Comments: 0

By Brian Fuller Silicon CMOS is a tough act to follow. The workhorse building block for the world’s electronics has been delivering for system designers for a half century. Despite hand-wringing over its apparent scalability limits, it shows only vague signs of slowing down. For nearly as many years, it seems, the next great material or alternative to silicon CMOS has popped into the indu... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Vanderbilt

Manufacturing Bits: Nov. 18

Power/Performance Bits: June 3

Manufacturing Bits: April 29

Grappling With Graphene

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