One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging Using a Photosensitive Dielectric Material

By Veeco - 22 May, 2019 - Comments: 0

Authors: Warren W. Flack, Robert Hsieh, Ha-Ai Nguyen Ultratech, a division of Veeco 3050 Zanker Road, San Jose, CA 95134 USA [email protected] John Slabbekoorn, Samuel Suhard, Andy Miller IMEC Kapeldreef 75 B-3001 Leuven, Belgium [email protected] Akito Hiro, Romain Ridremont JSR MICRO NV Technologielaan 8 B-3001 Leuven, Belgium [email protected] Abstract This... » read more

Low Ripple Notch Filter Designs Using Apodized Thickness Modulation

By Veeco - 21 Mar, 2019 - Comments: 0

An apodized discrete layer thickness design method for notch filters is presented. The method produces error tolerant designs with low ripple in the pass band regions without any additional numerical optimization. Sample designs are presented. Multiple approaches have been used in the past for producing notch filters (also called minus filters). The two main approaches can be grouped into ru... » read more

Gaps In 5G Test

By Kevin Fogarty - 20 Mar, 2019 - Comments: 0

Add one more industry to the long list that analysts expect 5G technology to disrupt—test. While the initial versions of this wireless technology will be little more than a faster version of 4G, concern is growing about exactly how to test the second phase of this technology, which will be based upon millimeter wave. A number of fundamental problems need to be addressed. Among them: T... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 07 Sep, 2018 - Comments: 0

Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 03 Feb, 2017 - Comments: 0

Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 07 Oct, 2016 - Comments: 0

Fab tools and materials After a series of delays due to regulatory issues, Lam Research and KLA-Tencor have agreed to terminate their proposed merger agreement. Amid a possible proxy battle, Kulicke & Soffa Industries has named Fusen Chen as president and chief executive, effective Oct. 31. He was also elected to the board of K&S. Jonathan Chou, chief financial officer and interim CEO, w... » read more

China’s Capital Equipment Market To Boom

By Jeff Dorsch - 18 Aug, 2016 - Comments: 1

The worldwide semiconductor capital equipment market declined 3% last year to $36.53 billion from 2014’s $37.5 billion, but inside China the story was significantly different. Capital equipment sales there increased by 12% in 2015, to $4.9 billion. In fact, only Japan showed a higher growth rate last year, of 31%, according to figures from [getentity id="22821" comment="SEMI"] and the Semi... » read more

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tag: Veeco Instruments

One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging Using a Photosensitive Dielectric Material

Low Ripple Notch Filter Designs Using Apodized Thickness Modulation

Gaps In 5G Test

Week In Review: Manufacturing, Test

The Week In Review: Manufacturing

The Week In Review: Manufacturing

China’s Capital Equipment Market To Boom