External Resistance Reduction By Nanosecond Laser Anneal In Si/SiGe CMOS Technology


Authors: 1Oleg Gluschenkov, 1Heng Wu, 1Kevin Brew, 2Chengyu Niu, 1Lan Yu, 1Yasir Sulehria, 1Samuel Choi, 22Curtis Durfee, 1James Demarest, 1Adra Carr, 3Shaoyin Chen, 3Jim Willis, 3Thirumal Thanigaivelan, 1Fee-li Lie, 2Walter Kleemeier, and 1Dechao Guo 1IBM Research, 257 Fuller Road, Albany, NY 12203, USA, email: [email protected] 2GLOBALFOUNDRIES Inc., Albany, NY, USA, 3ULTRATECH, a division ... » read more

Intra-Field Stress Impact on Global Wafer Deformation


One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., thermal expansion coefficients) may result in process-induced warpage of the wafers at room temperature. When these warped wafers are loaded onto the scanner for the next layer exposure, in-plane disto... » read more

One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging Using a Photosensitive Dielectric Material


Authors: Warren W. Flack, Robert Hsieh, Ha-Ai Nguyen Ultratech, a division of Veeco 3050 Zanker Road, San Jose, CA 95134 USA [email protected] John Slabbekoorn, Samuel Suhard, Andy Miller IMEC Kapeldreef 75 B-3001 Leuven, Belgium [email protected] Akito Hiro, Romain Ridremont JSR MICRO NV Technologielaan 8 B-3001 Leuven, Belgium [email protected] Abstract This... » read more

Low Ripple Notch Filter Designs Using Apodized Thickness Modulation


An apodized discrete layer thickness design method for notch filters is presented. The method produces error tolerant designs with low ripple in the pass band regions without any additional numerical optimization. Sample designs are presented. Multiple approaches have been used in the past for producing notch filters (also called minus filters). The two main approaches can be grouped into ru... » read more

Gaps In 5G Test


Add one more industry to the long list that analysts expect 5G technology to disrupt—test. While the initial versions of this wireless technology will be little more than a faster version of 4G, concern is growing about exactly how to test the second phase of this technology, which will be based upon millimeter wave. A number of fundamental problems need to be addressed. Among them: T... » read more

Week In Review: Manufacturing, Test


Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

The Week In Review: Manufacturing


Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

The Week In Review: Manufacturing


Fab tools and materials After a series of delays due to regulatory issues, Lam Research and KLA-Tencor have agreed to terminate their proposed merger agreement. Amid a possible proxy battle, Kulicke & Soffa Industries has named Fusen Chen as president and chief executive, effective Oct. 31. He was also elected to the board of K&S. Jonathan Chou, chief financial officer and interim CEO, w... » read more

China’s Capital Equipment Market To Boom


The worldwide semiconductor capital equipment market declined 3% last year to $36.53 billion from 2014’s $37.5 billion, but inside China the story was significantly different. Capital equipment sales there increased by 12% in 2015, to $4.9 billion. In fact, only Japan showed a higher growth rate last year, of 31%, according to figures from [getentity id="22821" comment="SEMI"] and the Semi... » read more