Raising SoC Development Productivity With Portable Stimulus

By Mark Olen - 25 Jan, 2018 - Comments: 0

The semiconductor industry has achieved significant productivity increases by virtue of the development, deployment, and scalability of reusable design IP. The EDA industry has also achieved significant productivity increases by virtue of the development, deployment, and scalability of reusable verification IP. A remaining bottleneck in the SoC development process stems from the inability to re... » read more

Predictions: Methodologies And Tools

By Brian Bailey - 25 Jan, 2018 - Comments: 0

Predictions are divided into four posts this year. Part one covered markets and drivers. The second part looked at manufacturing, devices and companies and this part will cover methodologies and tools. In addition, the outlook from EDA executives will be provided in a separate post. Intellectual property As designs get larger, it should be no surprise that the size of the [getkc id="43" kc_... » read more

Follow The Moving Money

By Ed Sperling - 18 Jan, 2018 - Comments: 1

Semiconductor economics are changing by market, by region, and by product node and packaging type, adding new complexity into decisions about which technology to use for which products and why. Money is the common denominator in all of these decisions, whether it's measured by return on invested capital, quarterly profits, or long-term investments that can include acquisitions, organic growt... » read more

Getting Serious About Chiplets

By Ann Mutschler - 08 Jan, 2018 - Comments: 0

Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

Which Verification Engine?

By Ed Sperling - 02 Jan, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the state of verification with Jean-Marie Brunet, senior director of marketing for emulation at [getentity id="22017" e_name="Mentor, a Siemens Business"]; Frank Schirrmeister, senior group director for product management at [getentity id="22032" e_name="Cadence"]; Dave Kelf, vice president of marketing at [getentity id="22395" e_name="OneSpin Solut... » read more

Reflections On 2017: Manufacturing And Markets

By Brian Bailey - 28 Dec, 2017 - Comments: 0

People love to make predictions, and most of the time they have it easy, but at Semiconductor Engineering, we ask them to look back on the predictions they make each year and to assess how close to the mark they were. To see what they missed and what surprised them. Not everyone accepts our offer to grade themselves, but many have this year. This is the first of two parts that looks at the pred... » read more

And The Winner Is…

By Brian Bailey - 21 Dec, 2017 - Comments: 0

Finding out what resonates with our readers is important, so each year I look back through the list of the best-read articles for the channels that I write for. While this simple strategy does favor articles published during the early part of the year, the fact that our readership continues to grow, partially offsets this bias. For example, in Low Power/High Performance (LPHP) a quarter of the ... » read more

Is Verification Falling Behind?

By Brian Bailey - 21 Dec, 2017 - Comments: 1

Every year that [getkc id="74" comment="Moore's Law"] is in effect means that the [getkc id="10" kc_name="verification"] task gets larger and more complex. At one extreme, verification complexity increases at the square of design complexity, but that assumes that every state in the design is usable and unique. On the other hand, verification has not had the luxury that comes with design reuse b... » read more

Design Chains Will Drive The Top 5 EDA Trends In 2018

By Frank Schirrmeister - 21 Dec, 2017 - Comments: 0

In my prediction piece last year, I made seven trend predictions. Looking back, I did very well compared to what actually happened. For 2018, I am cutting it down to five trends that will impact EDA, but in my mind a lot of the trends will be driven by the ever-evolving ecosystem of design chains from IP though semiconductor to systems and to OEMs. While HBO’s 'Game of Thrones' comes to a con... » read more

Mixing Interface Protocols

By Ann Mutschler - 21 Dec, 2017 - Comments: 0

Continuous and pervasive connectivity requires devices to support multiple interface protocols, but that is creating problems at multiple levels because each protocol is based on a different set of assumptions. This is becoming significantly harder as systems become more heterogeneous and as more functions are crammed into those devices. There are more protocols that need to be supported to ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?