Review Of Virtual Wafer Process Modeling And Metrology For Advanced Technology Development

By Coventor - 17 Apr, 2024 - Comments: 0

Semiconductor logic and memory technology development continues to push the limits of process complexity and cost, especially as the industry migrates to the 5 nm node and beyond. Optimization of the process flow and ultimately quantifying its physical and electrical properties are critical steps in yielding mature technology. The standard build, test, and wait model of technology development ... » read more

Demonstrating The Capabilities Of Virtual Wafer Process Modeling And Virtual Metrology

By Technical Paper Link - 27 Jul, 2023 - Comments: 0

A technical paper titled “Review of virtual wafer process modeling and metrology for advanced technology development” was published by researchers at Coventor Inc., Lam Research. Abstract: "Semiconductor logic and memory technology development continues to push the limits of process complexity and cost, especially as the industry migrates to the 5 nm node and beyond. Optimization of the p... » read more

Using AI To Improve Metrology Tooling

By Laura Peters - 17 Apr, 2023 - Comments: 0

Virtual metrology is carefully being added into semiconductor manufacturing, where it is showing positive results, but the chip industry is proceeding cautiously. The first use of this technology has been for augmenting existing fab processes, such as advanced process control (APC). Controlling processes and managing yield generally do not require GPU processing and advanced algorithms, so t... » read more

AI In Chip Manufacturing

By Ed Sperling - 10 Jan, 2019 - Comments: 0

Ira Leventhal, New Concept Product Initiative vice president at Advantest, talks with Semiconductor Engineering about using analysis and deep learning to make test more efficient and more effective. https://youtu.be/3VVG4JVnjHo » read more

Practical Methods To Overcome The Challenges Of 3D Logic Design

By Benjamin Vincent - 25 Jun, 2018 - Comments: 0

What should you do If you don’t have enough room on your floor to store all your old boxes? Luckily, we live in a 3D world, and you can start stacking them on top of each other. The Challenge: How can we shrink logic devices? Logic designers are currently facing even bigger challenges than you might be having in tidying up your storage area. Not only are logic cells highly packed together... » read more

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tag: virtual metrology

Review Of Virtual Wafer Process Modeling And Metrology For Advanced Technology Development

Demonstrating The Capabilities Of Virtual Wafer Process Modeling And Virtual Metrology

Using AI To Improve Metrology Tooling

AI In Chip Manufacturing

Practical Methods To Overcome The Challenges Of 3D Logic Design