Chip Industry Week In Review


The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

Research Bits: May 30


Improving qubits Researchers from QuTech say they have improved the ‘Andreev spin qubit’ by taking the two most promising qubits — the spin qubits in semiconductors and transmon qubits in superconducting circuits — and finding a hybrid way that uses the best of both qubit types. “Spin qubits are small and compatible with current industrial technology, but they struggle with interact... » read more

Week In Review: Auto, Security, Pervasive Computing


The U.S. Cybersecurity and Infrastructure Security Agency (CISA) issued a cybersecurity warning about Chinese state-sponsored activity impacting networks across U.S. critical infrastructure. “One of the actor’s primary tactics, techniques, and procedures (TTPs) is living off the land, which uses built-in network administration tools to perform their objectives," the agency said. Hacking eff... » read more

Manufacturing Bits: July 7


Silicon photonics prototyping A group of European and other research organizations have put the finishing touches on a project to help propel the development of silicon photonics into the commercial market. The project, dubbed ESSenTIAL, enables small- to mid-sized enterprises to develop prototypes and products based on silicon photonics. Funded by the European Commission, the project inclu... » read more

Manufacturing Bits: Feb. 24


EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more

Manufacturing Bits: Sept. 2


Looking at space dust The first analysis of space dust, collected by a special collector onboard NASA's Stardust mission and sent back to Earth for study in 2006, is more complex in composition and structure than previously thought. Researchers examined the dust using synchrotron light sources from three groups--the U.S. Department of Energy's Argonne National Laboratory, Lawrence Berkeley... » read more