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Harnessing The Power Of Data In Semiconductor Test


Every day, new methods are being developed to harvest, cleanse, integrate, and analyze data sources and extract from them useful, actionable intelligence to aid decision-making and other processes. This is true for a variety of industries, including semiconductor design, manufacturing, and test. Moore’s Law (figure 1) may be slowing with respect to traditional scaling of transistor critica... » read more

Software-Driven and System-Level Tests Drive Chip Quality


Traditional semiconductor testing typically involves tests executed by automatic test equipment (ATE). But engineers are beginning to favor an additional late-test pass that tests systems-on-chip (SoCs) in a system context in order to catch design issues prior to end-product assembly. “System-level test (SLT) gives a high-volume environment where you can test the hardware and software toge... » read more

Characterization Of Micro-Bumps For 3DIC Wafer Acceptance Tests


The strong market needs to embed multiple functionalities from different semiconductor processing technologies into a single system continue to drive demands for more advanced 3DIC packaging technologies. Dimensions of copper pillar micro-bumps are consistently reduced in every new technology node to facilitate the 3D stacking of multiple dies so that overall system performance can be improved.... » read more

Testing More To Boost Profits


Not all chips measure up to spec, but as more data becomes available and the cost of these devices continues to rise, there is increasing momentum to salvage and re-purpose chips for other applications and markets. Performance-based binning is as old as color-banded resistors, but the practice is spreading — even for the most advanced nodes and packages. Over the last three decades, engine... » read more