Chip Industry Technical Paper Roundup: Oct. 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=371 /]   More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Thermal Modeling For 2.5D And 3D Integrated Chiplets


A new technical paper titled "MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures" was published by researchers at University of Wisconsin–Madison, Washington State University, and University of Ulsan. Abstract: "Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D d... » read more

Research Bits: Aug. 8


Speeding NVM encryption Researchers from North Carolina State University propose a way to speed up encryption and file system performance for non-volatile memory (NVM). “NVMs are an emerging technology that allows rapid access to the data, and retains data even when a system crashes or loses power,” said Amro Awad, an assistant professor of electrical and computer engineering at North C... » read more

Memristive synaptic device based on a natural organic material—honey for spiking neural network in biodegradable neuromorphic systems


New academic paper from Washington State University, supported by a grant from the National Science Foundation. Abstract: "Spiking neural network (SNN) in future neuromorphic architectures requires hardware devices to be not only capable of emulating fundamental functionalities of biological synapse such as spike-timing dependent plasticity (STDP) and spike-rate dependent plasticity (SRDP),... » read more

System Bits: Feb. 5


Rubbery material for stretchable electronics Researchers at the University of Houston came up with a rubbery semiconducting material that they say could find applications in stretchable electronics, such as human-machine interfaces, implantable bioelectronics, and robotic skins. Cunjiang Yu, Bill D. Cook Assistant Professor of mechanical engineering at the University of Houston and correspo... » read more

Power/Performance Bits: Oct. 23


Integrated solar battery Researchers at the University of Wisconsin–Madison and King Abdullah University of Science and Technology (KAUST) built a unified solar cell-liquid battery device capable of returning more than 14% of the incoming solar energy as electricity. The device is capable of both converting solar energy to electricity for immediate use or storing it as chemical energy in ... » read more

Power/Performance Bits: Sept. 12


Water-based li-ion battery Researchers at the University of Maryland and the U.S. Army Research Laboratory developed a lithium-ion battery that uses a water-salt solution as its electrolyte and reaches the 4.0 volt mark desired for household electronics, without the fire and explosive risks associated with some commercially available non-aqueous lithium-ion batteries. The battery provides i... » read more

Manufacturing Bits: June 27


World’s brightest laser The University of Nebraska-Lincoln has set the unofficial record for the world’s brightest laser. Researchers have focused a laser at a brightness of 1 billion times greater than the surface of the sun. This feat was accomplished using the so-called Diocles Laser at the University of Nebraska-Lincoln. The laser has a combination of peak power and a repetition ra... » read more

Power/Performance Bits: Oct. 11


Getting to 1nm Researchers at the Lawrence Berkeley National Laboratory, UC Berkeley, University of Texas at Dallas, and Stanford University created a transistor with a working 1nm gate from carbon nanotubes and molybdenum disulfide (MoS2). "The semiconductor industry has long assumed that any gate below 5 nanometers wouldn't work, so anything below that was not even considered," said fir... » read more

Power/Performance Bits: March 1


Low power Wi-Fi Computer scientists and electrical engineers from the University of Washington came up with a way to generate Wi-Fi transmissions using 10,000 times less power than conventional methods and which consumes 1,000 times less power than existing energy-efficient wireless communication platforms such as Bluetooth Low Energy and Zigbee. The system, Passive Wi-Fi, uses backscatte... » read more

← Older posts