System Bits: Dec. 16

By Ann Mutschler - 16 Dec, 2014 - Comments: 0

High rise chip For decades, the mantra of the semiconductor industry has been ‘smaller, faster, cheaper.’ Stanford researchers are also adding ‘taller’ to the mix, and describing how to build high-rise chips that promise to leapfrog the performance of the single-story logic and memory chips on today's circuit cards. Stanford researchers said their approach would end the ‘logjams�... » read more

One-On-One: Mike Muller

By Ed Sperling - 13 Oct, 2014 - Comments: 0

SE: What happens with memory, where access is more localized? Muller: Hybrid memory cube is one approach. HBM is another. ARM is chairing an IEEE standards group for a next-gen memory interface to make sure we build memories that fit mobile as well as networking and classic servers. Whereas in the past, memories were driven from the performance, we need to make the power scales with the band... » read more

Processor IP Enabling The Wearable Trend

By Ellie Stone - 12 Jun, 2014 - Comments: 0

Wearable technology is one of the fastest growing market segments. It is expected to be the next big thing in the field of computing and could, over the next decade, become as large as the mobile market is today. Its growth will depend on innovative devices providing a better user experience to their non-wearable alternatives, as well as broad availability of these products backed by a supporti... » read more

What’s Wrong With Power Signoff

By Ed Sperling - 12 Jun, 2014 - Comments: 0

Reducing power has emerged as the most pressing issue in the history of technology. On one hand, it’s the biggest opportunity the electronics industry has ever seen. On the other, the abuse of cheap power has been linked to global warming, human catastrophe, and geopolitical strife. In all cases, the semiconductor increasingly finds itself at the vortex of all of this, and making chips more e... » read more

Power/Performance Bits: April 29

By Ann Mutschler - 29 Apr, 2014 - Comments: 0

Lithium-free flexible battery A Rice University laboratory has flexible, portable and wearable electronics in its sights with the creation of a thin film for energy storage. The researchers have developed a flexible material with nanoporous nickel-fluoride electrodes layered around a solid electrolyte to deliver battery-like supercapacitor performance that combines the best qualities of a h... » read more

Inspired By The IoT Yet?

By Ann Mutschler - 10 Apr, 2014 - Comments: 1

You can't go too far in the world of technology today without running into the topic of the Internet of Things (IoT). And I don't know about you but the momentum is fascinating – not just the technology side, because innovation is always interesting, but also on the business development side of things due to the seemingly limitless potential for connectivity of devices that previously weren�... » read more

Blog Review: Jan. 8

By Ed Sperling - 08 Jan, 2014 - Comments: 0

How do you choose an embedded operating system—and do you even need one? Mentor’s Colin Walls looks at the options, and the reason why there are no simple answers. Cadence’s Richard Goering has evidence that Facebook is gaining in popularity for engineer. He’s not the first person to recognize this shift, but the big unanswered questions are, ‘What’s the average age of those use... » read more

Wearing My Computer

By Frank Ferro - 25 Jul, 2013 - Comments: 0

By Frank Ferro I have been in a friendly debate with my colleagues (to remain nameless) for some time now about the future of ‘wearable devices.’ The most recent examples are the new Google glasses and the latest incarnation of the smart watch. I’m not a fan of either. I am trying to keep an open mind, however, because my natural inclination is not to overtly wear electronics. I could ne... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: wearable electronics