Power/Performance Bits: Sept. 15


Stretchy metal Washington State University researchers stretched metal films used in flexible electronics to twice their size without breaking. The discovery could lead to dramatic improvements and addresses one of the biggest challenges in flexible electronics, an industry still in its infancy with applications such as bendable batteries, robotic skins, wearable monitoring devices and se... » read more

Blog Review: Aug. 26


Synopsys' Marc Greenberg attended IDF and learned more about the newly announced Intel/Micron 3D XPoint memory technology named Optane including initial ship dates and some implementation details. In concluding his analysis of the 2014 Functional Verification Study, Mentor's Harry Foster reveals an unexpected finding about design size and respins. How do you keep your power grid from bein... » read more

The Next Big Things


Progress in electronics has always been about combining more functions into devices and making access to information more convenient. This is what drove the PC revolution in the 1980s, when centralized data was made available on desktops, and it's what drove the notebook PC revolution in the 1990s as computers became untethered from the desktop, as long as you could find an Ethernet connecti... » read more

Power/Performance Bits: May 26


Woven fabric electrodes An international team including scientists from the University of Exeter pioneered a new technique to embed transparent, flexible graphene electrodes into fibers commonly associated with the textile industry. Exeter Professor Monica Craciun, co-author of the research said: "This is a pivotal point in the future of wearable electronic devices. The potential has been... » read more

IP Market Shifts Direction


Semiconductor Engineering sat down to discuss intellectual property changes and challenges with Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Navraj Nandra, senior director of marketing for DesignWare analog and MSIP at [getentity id="22035" e_name="Synopsys"]; Kurt Shuler, vice president of marketing at [getentity i... » read more

Energy Harvesting Update


Manos Tentzeris, professor of electrical and computer engineering at the Georgia Institute of Technology, sat down with Semiconductor Engineering to discuss energy harvesting. What follows are excerpts of that conversation. SE: What is the state of energy harvesting and are we making progress. Tentzeris: The latest results are systems with efficiency up to 40% to 45% utilizing ambient UH... » read more

The Week In Review: Design/IoT


Embedded Mentor Graphics released a new version of their Nucleus RTOS with a focus on high-performance IoT and wearable applications. Updates include support for Dynamic Linking and Loading (DLL) capabilities in Cortex-M based cores; the ability for developers to reconfigure, update, and provision connected embedded devices that utilize cloud-based remote software services; and TI WiLink 8 m... » read more

The Next Generation Of Wearables


As the wearable market begins to take root, so has the focus on ultra-low power design—with some unique headaches that are unique to wearables. To begin with, there is much attention being paid to this market because of the almost staggering predictions associated with it. While numbers vary greatly, IDC predicts as many as 126 million units will be shipping annually by 2019. The five-year... » read more

FD-SOI Vs. FinFETs


Semiconductor Engineering sat down to compare the benefits, risks and challenges of moving to finFETs compared with fully depleted silicon on insulator ([getkc id="220" kc_name="FD-SOI"]) with Philippe Magarshack, group vice president for technology R&D at [getentity id="22331" comment="STMicroelectronics"]; Marco Brambilla, director of engineering at [getentity id="22150" e_name="Synapse D... » read more

TSMC Tech Tour De Force


TSMC held the first of its three North American Tech Symposiums on April 7 in San Jose, with the other two coming up in Boston on April 14 and in Austin on April 16. As was mentioned previously here, the record fast ramp-time of the 20nm node was highlighted among other technological achievements. TSMC also released its March revenue report on April 10, and it shows a dramatic 49.8% increase in... » read more

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