tag: wirebonding

Wire Bond Electrical Structural Test Methodologies
By Keysight - 28 Aug, 2024 - Comments: 0

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, in the case of multi-chip modules, between different chips. This intricate process ensures the device's functionality, reliability, and overall performance. Wire bonding faces several challenges ... » read more

Big Shifts In Power Electronics Packaging
By Laura Peters - 16 Nov, 2023 - Comments: 0

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the packaging needed to protect and connect these devices. Packaging is playing an increasingly critical role in the transition to higher power densities, enabling more efficient power supplies, power deli... » read more

Wirebonding Is Here To Stay
By Gregory Haley - 19 Oct, 2023 - Comments: 0

Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, has been a cornerstone of the electronics industry since the beginning of the electronics industry. Like everything else in the semiconductor market, wirebonding technologies have changed over ... » read more

3D Structures Challenge Wire Bond Inspection
By Karen Heyman - 09 May, 2023 - Comments: 1

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it remains the bonding approach of choice for a broad swath of applications. This is particularly evident in automotive, industrial, and many consumer applications, where the majority of chips are not de... » read more

ILP-Based Router for Wire-Bonding FBGA Packaging Design
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design" was written by researchers at National Taiwan University of Science and Technology. "In this paper, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-depende... » read more

Technology Advances, Shortages Seen For Wire Bonders
By Mark LaPedus - 17 Feb, 2022 - Comments: 2

A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no... » read more

Robust Growth And Strong Outlook For Semiconductor Materials
By Inna Skvortsova - 20 May, 2021 - Comments: 0

2020 was a year that made a mark in the history of mankind as well as the semiconductor industry. It was a year of business and personal disruptions caused by COVID-19, supply chain interruptions, and exceptional agility of industries coping with the new normal imposed by the pandemic. Nevertheless, it was a year of extraordinary growth for the semiconductor industry, including semiconductor ma... » read more

Defect Challenges Grow For IC Packaging
By Mark LaPedus - 22 Oct, 2020 - Comments: 0

Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these technologies are necessary, they also are complementary. No one tool can meet all defect inspection requirements. As a result, packaging vendors may need to buy more and different tools. For years, p... » read more

What’s Next In Advanced Packaging
By Mark LaPedus - 20 Jun, 2019 - Comments: 3

Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

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