Over 65% Smartphone RF Switches SOI, Says Yole; Power Amps Next

By Various Writers - 14 Aug, 2013 - Comments: 0

By Adele Hars The industry research firm Yole Développement says that more than 65 percent of substrates used in fabricating switches for handsets are SOI-based. This is a high-growth part of the market, putting up double-digit increases. Like a standard SOI wafer, an RF SOI substrate has an active (“top”) layer on which CMOS transistors are built, with an isolating (“BOx”) ... » read more

ST-Ericsson 28nm FD-SOI smartphone SOC, Q3 tape-out (interview)

By Various Writers - 24 Apr, 2012 - Comments: 0

ASN recently had a chance to talk to ST-Ericsson’s Chief Chip Architect Louis Tannyeres about the move to 28nm FD-SOI for smartphones and tablet SOCs. Take-away message: FD-SOI solves – with less process complexity – scaling, leakage and variability issues to further shrink CMOS technology beyond 28nm. Here's what he said. ~~ [caption id="attachment_441" align="alignleft" wi... » read more

Tires That Talk

By Ed Sperling - 14 Sep, 2009 - Comments: 0

[youtube vid=JHxu-FWYxlw] » read more

Cognitive Radio

By Ed Sperling - 14 Sep, 2009 - Comments: 0

[youtube vid=DYDZ64RtB_A] » read more

Making A Multicore System Work

By Ed Sperling - 29 Jan, 2009 - Comments: 0

If you think designing a single-core system is hard, designing multicore systems is multiple times harder. Connecting all the pieces together and making them work properly, if not together, is one of the hardest tasks design engineers and architects will ever face. System-Level Design tracked down some of the experts in this field and sat them down around a table to discuss what’s going... » read more

Achieving Successful LTE Design and Test

By Cheryl Ajluni - 22 Jan, 2009 - Comments: 0

By Cheryl Ajluni In spite of all of its hype, WiMAX is not the only standard causing a stir these days or being called a “killer app.” Another technology that has achieved this illustrious title is Long Term Evolution (LTE), the Third Generation Partnership Project’s (3GPP’s) air interface for wireless access. Granted, WiMAX does have the advantage of a head start in development, test... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer