Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS

By Amkor - 18 Aug, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging [1]. Wafer-level fanou... » read more

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS

By Amkor - 17 Feb, 2021 - Comments: 0

RF Device And Process Biz Heats Up

By Mark LaPedus - 26 Apr, 2017 - Comments: 0

The RF device and process technology markets are heating up, especially for two critical components used in smartphones—RF switch devices and antenna tuners. RF device makers and their foundry partners continue to ramp up traditional RF switch chips and tuners based on RF SOI process technologies for today’s 4G wireless networks. And recently, [getentity id="22819" comment="GlobalFoundri... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 15 May, 2015 - Comments: 0

Cypress Semiconductor has made a bid to buy U.S. memory maker Integrated Silicon Solution Inc. (ISSI). In fact, Cypress may have started a bidding war against a Chinese consortium to buy ISSI. In March, a Chinese consortium of investors led by Summitview Capital entered into a definitive merger agreement to acquire ISSI. The proposed transaction values ISSI’s equity at approximately $639.5 mi... » read more

New Foundry Gold Rush: RF SOI

By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus About every five years or so, a new and hot market emerges in the specialty foundry business that resembles a frenetic gold rush. The last big gold rush occurred around 2008, when more than a dozen foundries jumped into the bipolar-CMOS-DMOS (BCD) market to capitalize on the booming power-management sector. Now, the next gold rush is centering on an emerging technology—th... » read more

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Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS

RF Device And Process Biz Heats Up

The Week In Review: Manufacturing

New Foundry Gold Rush: RF SOI