Time To Revisit 2.5D And 3D

By Mark LaPedus - 17 Apr, 2014 - Comments: 2

Chipmakers are reaching various and challenging inflection points. In logic, many IC makers face a daunting transition from planar transistors at 20nm to finFETs at 14nm. And on another front, the industry is nearing the memory bandwidth wall. So perhaps it’s time to look at new alternatives. In fact, chipmakers are taking a hard look, or re-examining, one alternative—stacked 2.5D/3D chi... » read more

Executive Insight: Simon Davidmann

By Brian Bailey - 10 Apr, 2014 - Comments: 0

Every industry has some colorful characters and within the EDA industry, Simon Davidmann is certainly one that comes to mind. For the past 30-something years, Davidmann has provided guidance to the industry, stood up for what he believes in, been an inspiration to many entrepreneurs, and had some fun along the way. Simon is a serial entrepreneur, angel investor and he has been a key person invo... » read more

High Level Synthesis: Significant Differences Remain

By Brian Bailey - 09 Apr, 2014 - Comments: 1

In part 1 of this experts series on high-level synthesis (HLS), Semiconductor Engineering sat down with Mike Meredith, vice president of technical marketing at Cadence/Forte Design Systems; Mark Warren, Solutions Group director at Cadence; Thomas Bollaert, vice president of application engineering at Calypto; and Devadas Varma, senior director at Xilinx. The initial part of the discussion looke... » read more

High Level Synthesis Grows Up

By Brian Bailey - 13 Mar, 2014 - Comments: 2

When Semiconductor Engineering proposed this Experts At The Table discussion, which was held at the recently concluded DVCon, [getentity id="22032" e_name="Cadence"] had yet to express its intention to purchase [getentity id="22087" e_name="Forte"]. Little did we know that the stakes in the [gettech id="31015" comment="high-level synthesis"] (HLS) arena were being raised so high. Is this an in... » read more

Pointing Fingers In Verification

By Brian Bailey - 12 Mar, 2014 - Comments: 11

With most EDA tools, the buying decision is related to improved quality of results or increased productivity. Will a new synthesis or clock optimization tool enable designers to do more, faster and are those gains worth the price? The equation is fairly simple. When it comes to verification tools, things are more complex. You can still make productivity gains, or purchase an additional tool ... » read more

Evolution Vs. Revolution

By Ann Mutschler - 27 Feb, 2014 - Comments: 1

In the electronic design automation industry changes to tools and flows are nearly always evolutionary. They hide as much change from the user as possible, allowing easier justification from an ROI perspective, and they raise far fewer objections from users, who don’t have to spend time learning how to use new technology or rethink tried and true approaches to problems. Revolution in chip ... » read more

Can Intel Dethrone The Foundry Giants?

By Mark LaPedus - 12 Dec, 2013 - Comments: 3

The leading-edge foundry business isn’t for the faint of heart. It requires deep pockets and sound technology to keep pace in the chip-scaling race. And despite pouring billions of dollars into new fabs and processes, foundries are competing for fewer customers at each node. Given the difficult business conditions, only a handful of vendors can afford to compete in the high-end foundry bus... » read more

SpyGlass Flow For Xilinx FPGA

By Various Writers - 04 Dec, 2013 - Comments: 0

As the cost of doing ASIC design skyrockets, FPGAs are becoming an attractive alternative for system-on-chip (SoC) types of design. Large numbers of increasingly complex designs are now done with FPGAs, making verification a major task. Besides the usual issues of width mismatch, connectivity or synthesis-simulation mismatch, there are also problems related to multiple asynchronous clock domain... » read more

The Week In Review: Manufacturing & Design

By Mark LaPedus - 15 Nov, 2013 - Comments: 0

Gartner says the natural life cycle of a technology-driven company is less than 10 years. “To compete in this environment, business leaders must destroy and rebuild the very businesses they helped create,” said Steve Prentice, vice president and Gartner Fellow. He cited examples of IBM Personal Systems Group, Nokia, MySpace, Kodak, Borders, HMV and other companies that have struggled or eve... » read more

Front End Comes To The Back End

By Jeff Chappell - 19 Sep, 2013 - Comments: 0

By Jeff Chappell For outsourced assembly and test (OSAT) houses either planning for or already offering through-silicon via (TSV) capability for their 3D packaging efforts, this has meant the front end is coming to the back end, in a manner of speaking. A bit of an exaggeration perhaps, as most generalizations are. But thanks to TSVs, in a very real sense some of what would typically be the... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?