tag: Xilinx

Managing Complexity With Advanced Packaging
By Ed Sperling - 22 Mar, 2012 - Comments: 0

By Ann Steffora Mutschler Engineering teams across the globe continue to pound the process geometry treadmill to stay on the curve of Dr. Moore to achieve better speed or lower power or smaller die—and it all adds up to increased complexity in the design and packaging. However, with advanced forms of die stacking such as package-on-package, silicon-in-package, 2.5D silicon interposer techno... » read more

3D Standards For The Real World
By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Pallab Chatterjee Stacking die has progressed from what is technologically possible to what will be realistically feasible in a fabless or fab-lite world. The big challenges may be less about how to deal with stress caused by a TSV or thermal density and more about companies working together in a disaggregated supply chain. This was quite evident at a recent DesignCon panel dicussion on ... » read more

Mapping Out The Value Of TLM Modeling
By Frank Schirrmeister - 16 Nov, 2011 - Comments: 1

I have written about the value of system-level design and moving up to next level of abstraction numerous times. This fall one of the most interesting steps of progress towards effective system-level design and emphasis on the importance of embedded software has been made by the two big FPGA vendors Altera and Xilinx. Both vendors have announced devices combining programmable logic of up to sev... » read more

TSVs Ease Heat In 3D ICs
By Ed Sperling - 08 Sep, 2011 - Comments: 0

By Ann Steffora Mutschler In the evolving discussion of 3D ICs and through silicon via (TSV) technology, a key issue engineering teams are facing today is how to reduce the thermal coefficients between substrates in a stacked die. Simply put, what is the best way to get the heat out of the 2.5 or 3D IC? The answer, of course, is anything but simple. “In a 3D system, the heat hierarchy ... » read more

3D’s Disruptive And Less-Disruptive Sides
By Ed Sperling - 26 Aug, 2011 - Comments: 0

The momentum behind vertical stacking of die, either in 2.5D or 3D configurations, is growing. So is the argument about just how big a change this will actually represent. To a large extent, it all depends on where you’re sitting. Xilinx CTO Ivo Bolsens calls 3D stacking a disruptive technology. From an FPGA standpoint, which potentially could be used as a programmable addition to any SoC,... » read more

3D Stacking: A Reality Check
By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Ed Sperling The first 2.5D and 3D chips are expected to arrive next year, with the mainstream chip market expected to follow in 2013. While this trend already has seen its share of hype, stacked die—whether through a series of TSVs in true 3D or through an interposer layer in 2.5D—is as real as Moore’s Law. In fact, it’s a direct result of Moore’s Law. But unlike the progres... » read more

Experts At The Table: Power Budgeting
By Ed Sperling - 03 Jun, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat down with Barry Pangrle, solutions architect for low-power design and verification at Mentor Graphics; Cary Chin, director of technical marketing for low-power solutions at Synopsys; Vic Kulkarni, general manager of the RTL business unit at Apache Design Solutions; Matt Klein, principal engineer for power and broadcast applications at Xilinx; and Paul ... » read more

Experts At The Table: Power Budgeting
By Ed Sperling - 20 May, 2011 - Comments: 0

Low-Power Engineering sat down with Barry Pangrle, solutions architect for low-power design and verification at Mentor Graphics; Cary Chin, director of technical marketing for low-power solutions at Synopsys; Vic Kulkarni, general manager of the RTL business unit at Apache Design Solutions; Matt Klein, principal engineer for power and broadcast applications at Xilinx; and Paul van Besouw, presi... » read more

Experts At The Table: Power Budgeting
By Ed Sperling - 12 May, 2011 - Comments: 0

Low-Power Engineering sat down with Barry Pangrle, solutions architect for low-power design and verification at Mentor Graphics; Cary Chin, director of technical marketing for low-power solutions at Synopsys; Vic Kulkarni, general manager of the RTL business unit at Apache Design Solutions; Matt Klein, principal engineer for power and broadcast applications at Xilinx; and Paul van Besouw, presi... » read more

‘What If’ In 3D
By Ed Sperling - 28 Apr, 2011 - Comments: 0

By Ed Sperling ‘What if’ questions have become standard across multiple pieces of the design chain for any SoC, but the number is multiplying at each new process node. When the industry begins moving to 2.5D and 3D over the next couple years, the number of tradeoffs will likely move from overwhelming to unmanageable. That will set in motion a number of efforts in semiconductor design. ... » read more

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