Process Window Discovery And Control


With the continued need for shrinking pattern dimensions, semiconductor manufacturers continue to implement more complex patterning techniques, such as advanced multi-patterning, for the 10nm design node and beyond. They also are investing significant development effort in readying EUV lithography for production at the 7/5nm design nodes. Additionally, semiconductor manufacturers’ use of desi... » read more

The Most Expensive Defect


Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurement... » read more