tag: YieldHub

Reducing Costly Flaws In Heterogeneous Designs
By Ed Sperling - 08 Oct, 2019 - Comments: 0

The cost of defects is rising as chipmakers begin adding multiple chips into a package, or multiple processor cores and memories on the same die. Put simply, one bad wire can spoil an entire system. Two main issues need to be solved to reduce the number of defects. The first is identifying the actual defect, which becomes more difficult as chips grow larger and more complex, and whenever chi... » read more

The Unexpected Impact Of Lots On Hold
By Marie Ryan - 08 Oct, 2019 - Comments: 0

One of the biggest bottlenecks in any Subcon is Lots on Hold. The problem occurs many times a week on most factory floors. It’s something you’ve grown to loathe or endure. But, is there something you can do to reduce the amount of time lots spend on hold? In this article, we will explain what Lots on Hold are and how you can make the process less painful for your team and help improve on-ti... » read more

Testing Against Changing Standards In Automotive
By Ed Sperling and Kevin Fogarty - 08 Oct, 2019 - Comments: 0

The infusion of more semiconductor content into cars is raising the bar on reliability and changing the way chips are designed, verified and tested, but it also is raising a lot of questions about whether companies are on the right track at any point in time. Concerns about liability are rampant with autonomous and assisted driving, so standards are being rolled out well in advance of the te... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Sep, 2019 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has satisfied all closing conditions for the full acquisition of Mie Fujitsu Semiconductor Ltd. (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Ltd. (FSL). The completion of the acquisition is scheduled for Oct. 1. In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through pr... » read more

How Hardware Can Bias AI Data
By Ed Sperling - 10 Sep, 2019 - Comments: 1

Clean data is essential to good results in AI and machine learning, but data can become biased and less accurate at multiple stages in its lifetime—from moment it is generated all the way through to when it is processed—and it can happen in ways that are not always obvious and often difficult to discern. Blatant data corruption produces erroneous results that are relatively easy to ident... » read more

The Hidden Potential Of Test Engineers
By Marie Ryan - 10 Sep, 2019 - Comments: 0

Design engineers are seen as the cornerstone of new projects in many semiconductor companies, working away with the team to design the next product and making sure it meets all specifications. We pay little thought to the test engineer, who works in the shadows designing algorithms, hardware and software that could pass or fail each die. The test engineer is the last line of defense between... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Aug, 2019 - Comments: 0

AI chip boom or bust? The semiconductor industry is the most bullish about adopting artificial intelligence (AI), according to a new report from Accenture. Some 77% of semiconductor executives surveyed said they have adopted AI within their businesses or are piloting the technology. In addition, 63% of semiconductor executives expect that AI will have the greatest impact on their business over... » read more

More Semiconductor Data Moving To Cloud
By Ed Sperling - 06 Aug, 2019 - Comments: 0

The cloud is booming. After years of steady growth it has begun to spike, creating new options for design, test, analytics and AI, all of which have an impact on every segment of the semiconductor industry. The initial idea behind the cloud is that it would supplement processing done on premises, adding extra processing power wherever necessary, such as in the verification and debug stages o... » read more

Using Better Data To Shorten Test Time
By Ed Sperling - 06 Aug, 2019 - Comments: 1

The combination of machine learning plus more sensors embedded into IC manufacturing equipment is creating new possibilities for more targeted testing and faster throughput for fabs and OSATs. The goal is to improve quality and reduce the cost of manufacturing complex chips, where time spent in manufacturing is ballooning at the most advanced nodes. As the number of transistors on a die incr... » read more

Who Is Responsible For Part Average Testing?
By Kevin Robinson - 06 Aug, 2019 - Comments: 0

With ever-increasing demands in the automotive industry, more and more semiconductor companies are interested in monitoring and improving quality and reliability. Outlier detection and more specifically Part Average Testing (PAT) is the industry standard for the automotive industry. But, who is responsible for quality? Historically, OSATs are responsible for this. In the past, once they... » read more

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