Chip Industry Technical Paper Roundup: June 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=438 /] Find more semiconductor research papers here. » read more

Determinants Of Bond Wave Speed In Wafer Bonding (Yokohama, TEL)


A recent technical paper titled "Factors determining bond wave speed in wafer bonding" was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics. Abstract "Wafer-level direct bonding has become a critical process for advanced 3D architectures in logic, memory, and CMOS image sensors. The minimization of the wafer distortion caused by wafe... » read more

Med Tech Morphs Into Consumer Wearables


Doctors have been using advanced technology for years, but the growing trend is for consumers to use devices at home and have direct access to their data. Watches and rings that were once primarily used for counting steps or registering sleep patterns can now read blood pressure, heart rate, blood oxygen, body temperature, and other early signs of illness. Meanwhile, various patches are under d... » read more

Power/Performance Bits: Feb. 16


Superconducting microprocessor Researchers at Yokohama National University created a superconducting processor with zero electrical resistance. Huge amounts of power are being used by computers today, and compared to the human brain, they are many orders of magnitude less efficient. Superconductors have been a popular approach to making computers more efficient, but this requires extreme co... » read more