What’s behind the latest industry efforts and why this is so important.
Tom Salmon, vice president of collaborative technology platforms at SEMI, examines the electronics supply chain and what the industry organization is doing to pull all of the pieces together.
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The more compute power, the better. But what’s the best way to get there?
Yield rises with mask protection; multiple sources will likely reduce costs.
More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field.
CNTs promise big performance improvements, but achieving consistency and replacing incumbent technologies will be difficult.
Computational storage approaches push power and latency tradeoffs.
Gate-all-around FETs will replace finFETs, but the transition will be costly and difficult.
An upbeat industry at the start of the year met one of its biggest challenges, but instead of being a headwind, it quickly turned into a tailwind.
The backbone of computing architecture for 75 years is being supplanted by more efficient, less general compute architectures.
How long a chip is supposed to function raises questions design teams need to think about, including how much they trust aging models.
New interconnects and processes will be required to reach the next process nodes.
After failing in the fab race, the country has started focusing on less capital-intensive segments.
Servers today feature one or two x86 chips, or maybe an Arm processor. In 5 or 10 years they will feature many more.
SRC’s new CEO sheds some light on next-gen projects involving everything from chiplets to hyperdimensional computing and mixed reality.
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