What’s behind the latest industry efforts and why this is so important.
Tom Salmon, vice president of collaborative technology platforms at SEMI, examines the electronics supply chain and what the industry organization is doing to pull all of the pieces together.
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Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Companies battle it out to get artificial intelligence to the edge using various chip architectures as their weapons of choice.
Bulk CMOS, FD-SOI and finFETs all on tap as big players vie for differentiation. But where will chipmakers go after 28nm?
Consortiums seek ways to ensure interoperability of hardened IP as way of cutting costs, time-to-market, but it’s not going to be easy.
No shortage of alternatives as materials, packaging and architectural options grow, and plenty of startups are jumping in.
AI-enabled systems are being designed to process more data locally as device scaling benefits decline.
Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.
Foundry forms ASIC subsidiary as it focuses on 14nm/12nm and above.
Market overcrowding, more efficient manufacturing, and growing list of scaling issues create a challenging competitive landscape.
Chips will cost more to design and manufacture even without pushing to the latest node, but that’s not the whole story.
Using the Von Neumann architecture for artificial intelligence applications is inefficient. What will replace it?
At least 5 technologies are in the running, with 3D XPoint leading the pack.
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