Features And Benefits Of The SECS/GEM Standard – eBook


Discover how the SEMI E30 SECS/GEM standard empowers smarter, more efficient manufacturing by enabling factories to seamlessly collect equipment data, reduce integration costs, implement advanced process control, and improve overall operational performance. This eBook walks through key GEM capabilities—including collection events, alarms, recipe management, terminal services, and more—to s... » read more

AI With Open And Scaled Data Sharing in IC Manufacturing (NIST)


A new workshop report titled "Artificial Intelligence with Open and Scaled Data Sharing in Semiconductor Manufacturing" was published by NIST. Abstract "The Workshop sponsored by the National Science Foundation (NSF) (NSF award 2334590, "Artificial Intelligence with Open and Scaled Data Sharing in the Semiconductor Industry") and supported by the National Institute of Standards and Techno... » read more

Accelerating Digital Transformation With Tight Integration Of Manufacturing Data


Many semiconductor companies are involved in digital transformation of their overall processes and operations. Manufacturing is one of the most critical and value generating processes in a semiconductor company. Being able to tightly integrate manufacturing with the rest of the enterprise is a critical element of a successful digital transformation program. Recognizing the value of real-time... » read more

IC Equipment Communication Standards Struggle As Data Volumes Grow


The tsunami of data produced during wafer fabrication cannot be effectively leveraged without standards. They determine how data is accessed from equipment, which users need data access and when, and how fast it can be delivered. On top of that, best practices in data governance and data quality are needed to effectively interpret collected data and transfer results. When fab automation and ... » read more

Smart Manufacturing, Smart Data-AI, And Future Of Computing


By Melissa Grupen-Shemansky, Pushkar Apte, and Mark da Silva Use of machine learning and artificial intelligence (ML/AI) is on an exponential rise across fields1 including all aspects of the semiconductor industry. In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, search engines and now large language models like Chat... » read more

Increasing Roles For Robotics In Fabs


Different types of robots with greater precision and mobility are beginning to be deployed in semiconductor manufacturing, where they are proving both reliable and cost-efficient. Static robots have been used for years inside of fabs, but they now are being supplemented by collaborative robots (cobots), autonomous mobile robots (AMRs), and autonomous humanoid robots to meet growing and widen... » read more

Building Smarter, Better Fabs


Battling labor shortages, faster ramp rates, and data overload, the process of designing and building greenfield fabs requires a combination of tech tools, failing earlier approaches and superior planning from day one. The complexity and scale of semiconductor fabs is skyrocketing as is the capital cost. Chipmakers are looking to ramp multibillion dollar fabs faster despite the hurdles of la... » read more

Metrology And Inspection For The Chiplet Era


New developments and innovations in metrology and inspection will enable chipmakers to identify and address defects faster and with greater accuracy than ever before, all of which will be required at future process nodes and in densely packed assemblies of chiplets. These advances will affect both front-end and back-end processes, providing increased precision and efficiency, combined with a... » read more

Secure Movement Of Data In Test


Historically, test data flowed out of the tester and was loaded into a file. But with heterogeneous integration, including chiplets and IP from multiple vendors, test data is now being streamed across the manufacturing floor where it can be used to make real-time decisions. Eli Roth, product manager for smart manufacturing at Teradyne, talks with Semiconductor Engineering about challenges in da... » read more

Need To Share Data Widens In IC Manufacturing


Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management and grounding, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore,... » read more

← Older posts