Tech Talk: The New Cost Per Gate Equation

As 2.5D moves from PowerPoint to test chips, the economics of new packaging approaches are drawing a lot of attention.

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eSilicon’s Javier DeLaCruz talks with Semiconductor Engineering about new types of interposers, why just shrinking features is doomed, and what progress has been made in building 2.5D chips.




  • R Cole

    The organic interposer will increase the thermal resistance significantly