Tech Talk: The New Cost Per Gate Equation

As 2.5D moves from PowerPoint to test chips, the economics of new packaging approaches are drawing a lot of attention.


eSilicon’s Javier DeLaCruz talks with Semiconductor Engineering about new types of interposers, why just shrinking features is doomed, and what progress has been made in building 2.5D chips.


R Cole says:

The organic interposer will increase the thermal resistance significantly

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