A look at a Tier-1 mobile systems manufacturer’s newest architecture and how the company developed it.
The smartphone segment is certainly the most competitive market for chip makers today and the yearly product launch cadence puts a lot of pressure on the application processor design cycle. End-users expect to benefit from higher image definition, better sound quality, ever faster and more complex applications which push the limits of application processor performance in terms of higher frequency, lower latency, and reduced power consumption.
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While terms often are used interchangeably, they are very different technologies with different challenges.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
Key pivot and innovation points in semiconductor manufacturing.
Tools become more specific for Si/SiGe stacks, 3D NAND, and bonded wafer pairs.
Thinner photoresist layers, line roughness, and stochastic defects add new problems for the angstrom generation of chips.
Less precision equals lower power, but standards are required to make this work.
Open-source processor cores are beginning to show up in heterogeneous SoCs and packages.
While terms often are used interchangeably, they are very different technologies with different challenges.
New applications require a deep understanding of the tradeoffs for different types of DRAM.
Open source by itself doesn’t guarantee security. It still comes down to the fundamentals of design.
How customization, complexity, and geopolitical tensions are upending the global status quo.
127 startups raise $2.6B; data center connectivity, quantum computing, and batteries draw big funding.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
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