An artificially intelligent, wearable system that can predict if a conversation is happy, sad, or neutral based on a person’s speech patterns and vitals.
Source: Researchers from MIT’s Computer Science and Artificial Intelligence Laboratory (CSAIL) and Institute of Medical Engineering and Science (IMES); Tuka AlHanai and Mohammad Mahdi Ghassemi
“It’s a fact of nature that a single conversation can be interpreted in very different ways. For people with anxiety or conditions such as Asperger’s, this can make social situations extremely stressful. But what if there was a more objective way to measure and understand our interactions?
Researchers from MIT’s Computer Science and Artificial Intelligence Laboratory (CSAIL) and Institute of Medical Engineering and Science (IMES) say that they’ve gotten closer to a potential solution: an artificially intelligent, wearable system that can predict if a conversation is happy, sad, or neutral based on a person’s speech patterns and vitals.”
For the paper “Predicting Latent Narrative Mood using Audio and Physiologic Data”, click here
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Tech and auto giants are putting even more pressure on the semiconductor labor market. Some say it could be just what the industry needs.
There are at least three architectural layers to processor design, each of which plays a significant role.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Disaggregation and the wind-down of Moore’s Law have changed everything.
Leave a Reply