Ed Sperling

Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Is There A Crossover Point For Mainstream Anymore?
By Ed Sperling - 21 Nov, 2019 - Comments: 0

Until 28nm, it was generally assumed that process nodes would go mainstream one or two generations after they were introduced. So by the time the leading edge chips for smartphones and servers were being developed at 16/14nm and 10/7nm, it was assumed that developing a chip at 28nm would be less expensive, less complex, and that the process rule deck would shrink. That worked for decades. Th... » read more

Using Digital Twins And DL In Lithography
By Ed Sperling - 21 Nov, 2019 - Comments: 0

Leo Pang, chief product officer and executive vice president at D2S, looks at the results of inverse lithography technology at advanced nodes using curvilinear patterns, and how that can be combined with a digital twin and deep learning speed up time to market and reduce cost. » read more

Making Sense Of Inferencing Options
By Ed Sperling - 19 Nov, 2019 - Comments: 0

Ian Bratt, fellow in Arm’s machine learning group, sheds light on all the different processing elements in machine learning, how different end user requirements affect those choices, why CPUs are a critical element in orchestrating what happens in these systems, and how power and software play into these choices. » read more

RISC-V Markets, Security And Growth Prospects
By Ed Sperling - 18 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss open instruction set hardware with Ben Levine, senior director of product management in Rambus' Security Division; Jerry Ardizzone, vice president of worldwide sales at Codasip; Megan Wachs, vice president of engineering at SiFive; and Rishiyur Nikhil, CTO of Bluespec. What follows are excerpts of that conversation.  Part one of this discussion is ... » read more

Reducing Data At The Source
By Ed Sperling - 18 Nov, 2019 - Comments: 0

Jens Düge, group manager for image acquisition and processing in Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about how to slash the amount of data that needs to be sent to the cloud or edge for processing by focusing only on the regions of interest in an image, and how that reduces the cost of moving that data. » read more

GDDR6 Drilldown: Applications, Tradeoffs And Specs
By Ed Sperling - 15 Nov, 2019 - Comments: 0

Frank Ferro, senior director of product marketing for IP cores at Rambus, drills down on tradeoffs in choosing different DRAM versions, where GDDR6 fits into designs versus other types of DRAM, and how different memories are used in different vertical markets. » read more

AI’s Impact On Power And Performance
By Ed Sperling - 14 Nov, 2019 - Comments: 0

AI/ML is creeping into everything these days. There are AI chips, and there are chips that include elements of AI, particularly for inferencing. The big question is how well they will affect performance and power, and the answer isn't obvious. There are two main phases of AI, the training and the inferencing. Almost all training is done in the cloud using extremely large data sets. In fact, ... » read more

Using Machine Learning To Break Down Silos
By Ed Sperling - 13 Nov, 2019 - Comments: 0

Jeff David, vice president of AI solutions at PDF Solutions, talks with Semiconductor Engineering about where machine learning can be applied into semiconductor manufacturing, how it can be used to break down silos around different process steps, how active learning works with human input to tune algorithms, and why it’s important to be able to choose different different algorithms for differ... » read more

Addressing Pain Points In Chip Design
By Ed Sperling - 13 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

AI’s Blind Spots
By Ed Sperling - 12 Nov, 2019 - Comments: 1

The rush to utilize AI/ML in nearly everything and everywhere raises some serious questions about how all of this technology will evolve, age and perform over time. AI is very useful at doing certain tasks, notably finding patterns and relationships in broad data sets that are well beyond the capabilities of the human mind. This is very valuable for adding efficiency into processes of all so... » read more

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