Author's Latest Posts


Race Of Nations


Technology is the next arms race, and this is not just about national defense in the traditional sense. Countries collectively are pouring hundreds of billions of dollars into developing technology for the future, from education to outright grants and seed funding, and they are working with private industry to continue investing in their respective national futures. Which technologies and na... » read more

New Nodes, Materials, Memories


Ellie Yieh, vice president and general manager of Advanced Product Technology Development at [getentity id="22817" e_name="Applied Materials"], and head of the company's Maydan Technology Center, sat down with Semiconductor Engineering to talk about challenges, changes and solutions at advanced nodes and with new applications. What follows are excerpts of that conversation. SE: How far can w... » read more

Chip Aging Accelerates


Reliability is becoming an increasingly important proof point for new chips as they are rolled out in new markets such as automotive, cloud computing and industrial IoT, but actually proving that a chip will function as expected over time is becoming much more difficult. In the past, reliability generally was considered a foundry issue. Chips developed for computers and phones were designed ... » read more

The Race To Accelerate


Geoff Tate, CEO of [getentity id="22921" e_name="Flex Logix"], sat down with Semiconductor Engineering to discuss how the chip industry is changing, why that bodes well for embedded FPGAs, and what you need to be aware of when using programmable logic on the same die as other devices. What follows are excerpts of that conversation. SE: What are the biggest challenges facing the chip industry... » read more

Customizing Power And Performance


Designing chips is getting more difficult, and not just for the obvious technical reasons. The bigger issue revolves around what these chips going to be used for-and how will they be used, both by the end user and in the context of other electronics. This was a pretty simple decision when hardware was developed somewhat independently of software, such as in the PC era. Technology generally d... » read more

Tech Talk: Applying Machine Learning


Norman Chang, chief technologist at ANSYS, talks about real applications of machine learning for mechanical, fluid dynamics and chip-package-system design. https://youtu.be/MqYX0wbwSfE » read more

What’s In The Package?


Putting a variety of chips or hardened IP blocks into a package rather than trying to cram them into a single chip continues to gain ground. But it's also creating its own set of issues around verifying and testing these devices. This problem is well understood inside of SoCs, where everything is integrated into a single die. And looked at from a 30,000-foot perspective, packaging is someth... » read more

Cheaper Packaging Options Ahead


Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

Privacy Is In Retreat


It was always a given that when you were online, you're in public. The deceptive piece is that your online activities can appear very distant from your physical location. You might be shopping from the comfort and seeming privacy of your living room, or texting on your smart phone before you get out of bed. This created a lot of buzz initially, but over the past year or so the level of paran... » read more

Tech Talk: 5G


Mike Fitton, senior director of strategic planning at Achronix, talks about the new wireless standard, which will make its debut at the Winter Olympics, when it will go mainstream, and what kinds of technical issues need to be addressed to make that happen. https://youtu.be/tUEMKZpbN2Y » read more

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